Embedded Component Substrate CTE Warpage Control
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Solution Overview
Problem
In substrates with embedded electronic components, asymmetrical structures face challenges in warpage control, particularly as the area occupied by electronic components increases, leading to issues with thickness uniformity and rigidity, especially in systems like smartphones requiring both 4G and 5G compatibility.
Innovation Solution
The substrate design balances the coefficient of thermal expansion (CTE) between different insulating materials, incorporating a core structure with a lower CTE for the first insulating body and a higher CTE for the build-up structure, along with an insulating material with a lower CTE than the second insulating body, to manage warpage and ensure thickness uniformity, while allowing for modularization and miniaturization in a system-in-package (SiP) form.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an asymmetrical structure is used to embed electronic components, then component integration is improved, but warpage control deteriorates
Solution Approach 1:
The patent applies local quality by using different insulating materials with different CTE values in specific regions of the substrate. The first insulating body uses a material with lower CTE while the second insulating body uses a material with higher CTE, creating localized material properties that compensate for the asymmetrical structure and maintain overall dimensional stability.
Solution Approach 2:
The patent changes the CTE parameter of insulating materials in different regions to balance the overall thermal expansion characteristics. By selecting materials with specific CTE values (first insulating body material with lower CTE, second insulating body material with higher CTE), the patent optimizes the thermal expansion parameters to prevent warpage in asymmetrical configurations.
2Adaptability or versatility
If the area occupied by electronic components is increased, then functionality is improved, but thickness uniformity deteriorates
Solution Approach 1:
The patent implements local quality by positioning insulating materials with different CTE values in specific regions corresponding to electronic component locations. This localized material differentiation compensates for the uneven stress distribution caused by large component areas, maintaining thickness uniformity across the substrate.
3Volume of moving object
If miniaturization is implemented in SiP form, then device size is reduced, but warpage control becomes more difficult
Solution Approach 1:
The patent optimizes material parameters (CTE values) in the miniaturized SiP structure to maintain warpage control. By carefully selecting insulating materials with appropriate CTE values for the reduced scale geometry, the patent ensures that thermal expansion differences do not cause excessive warpage in the compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively controls warpage in both unit and strip units of the substrate, ensuring uniform thickness and rigidity, even in asymmetrical structures, facilitating the integration of active and passive components and enabling miniaturization for compact electronic devices.
Implementation Method 1
a coefficient of thermal expansion (CTE) is balanced by making a difference between an insulating material for embedding an electronic component and an insulating material for build-up
Data Source
AI summary
A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.