Embedded Substrate Shielding Structure for EMI-Protected Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing embedded substrate technologies face challenges in efficiently integrating electronic components with effective electromagnetic interference (EMI) shielding, often requiring costly and time-consuming external packaging methods that can lead to issues like residual glass fibers causing electric disconnection.
Innovation Solution
The substrate structure incorporates a conductive via penetrating through the dielectric layer, forming a shielding structure around the electronic components, which is built into the substrate, reducing package size and cost, and preventing EMI through conductive layers and vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If external packaging methods are used for EMI shielding, then EMI protection is provided, but package size increases and manufacturing cost increases
Solution Approach 1:
The patent merges the EMI shielding function with the substrate structure itself by integrating conductive layers and conductive vias directly into the substrate. This combination eliminates the need for separate external packaging methods, providing EMI protection while maintaining a compact package size.
Solution Approach 2:
The conductive shielding structure is nested within the substrate layers, with conductive vias penetrating through dielectric layers and conductive layers forming a shielding cavity that surrounds the embedded electronic component. This nested arrangement provides EMI protection without increasing the overall package volume.
2Object-affected harmful factors
If external packaging methods are used for EMI shielding, then EMI protection is provided, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple functions (structural support, electrical interconnection, and EMI shielding) into a single integrated substrate structure. This merging eliminates the need for separate external packaging components and processes, thereby reducing manufacturing complexity and cost.
Solution Approach 2:
The substrate structure serves multiple functions simultaneously: it provides mechanical support, electrical interconnection through conductive layers and vias, and EMI shielding through the integrated conductive shielding structure. This multi-functionality reduces the need for additional components and manufacturing steps.
3Object-affected harmful factors
If conductive via is formed adjacent to electronic component, then EMI shielding is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The conductive via is formed during the substrate manufacturing process before the electronic component is fully assembled. This preliminary formation of the shielding structure allows for better control of via placement and reduces the precision requirements during subsequent component assembly operations.
Solution Approach 2:
The conductive via is positioned specifically adjacent to the electronic component where EMI shielding is most needed, rather than requiring uniform precision throughout the entire substrate. This localized approach to shielding allows for relaxed precision requirements in areas where shielding is not critical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides efficient EMI protection within the substrate, minimizing package size and reducing manufacturing costs while avoiding issues of electric disconnection due to residual glass fibers.
Implementation Method 1
The first conductive via and at least one of the first conductive layer and the second conductive layer define a first shielding structure surrounding the electronic component
Data Source
AI summary
The present disclosure provides a substrate structure. The substrate structure includes an interconnection structure, a dielectric layer on the interconnection structure, an electronic component embedded in the dielectric layer, and a first conductive via penetrating through the dielectric layer and disposed adjacent to the electronic component. The interconnection structure includes a carrier having a first surface and a second surface opposite to the first surface, a first conductive layer disposed on the first surface of the carrier, and a second conductive layer disposed on the second surface of the carrier. The first conductive via and at least one of the first conductive layer and the second conductive layer define a first shielding structure surrounding the electronic component. A method of manufacturing a substrate structure is also disclosed.