Component-Embedded Substrate Positioning for Resin Flow Stability
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Solution Overview
Problem
Components embedded in multilayer substrates are prone to displacement due to resin flow during lamination, especially when the component's length in the lamination direction exceeds its width, leading to connectivity issues with desired or undesired conductors.
Innovation Solution
The component-embedded substrate design includes multiple components positioned closely in orthogonal directions within the laminate, with specific through holes and heat-pressing methods to minimize resin flow impact, ensuring components remain stable and connected effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If components are embedded in multilayer substrates with resin layers, then the substrate structure is formed, but resin flow during lamination causes component displacement
Solution Approach 1:
The patent applies preliminary anti-action by positioning a second component adjacent to the first component in the lamination direction before the resin flow occurs. This pre-positioning creates a physical constraint that counteracts the harmful resin flow, preventing the first component from displacing in the vertical direction during the lamination process.
Solution Approach 2:
The second component acts as an intermediary element between the first component and the resin flow. By placing the second component adjacent to the first component, it serves as a physical barrier or mediator that intercepts and limits the resin flow's impact on the first component, thereby maintaining positional stability.
2Reliability
If component length in lamination direction exceeds width, then component embedding is achieved, but displacement risk increases
Solution Approach 1:
The patent applies preliminary anti-action by pre-positioning the second component adjacent to the first component in the lamination direction. This creates a physical constraint before resin flow occurs, counteracting the displacement tendency of the first component and ensuring reliable connection to the desired conductor.
Solution Approach 2:
The patent changes the spatial arrangement parameter by positioning the second component at a specific distance from the first component in the lamination direction. This parameter change (creating a support structure with the second component) transforms the system's resistance to displacement, enabling reliable connection despite the first component's dimensions.
3Ease of manufacture
If multiple resin layers are laminated and heated, then multilayer substrate is formed, but component displacement occurs
Solution Approach 1:
The patent applies preliminary anti-action by pre-positioning the second component adjacent to the first component before the heating and lamination process. This creates a physical constraint that counteracts the resin flow during heating, maintaining manufacturing precision while allowing easy multilayer lamination.
Solution Approach 2:
The second component serves as an intermediary that protects the first component's position during the heating and lamination process. It mediates between the resin flow (caused by heating) and the first component, allowing the manufacturing process to proceed while maintaining positioning accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces component displacement and ensures reliable connection to conductors by maintaining component stability during resin flow and heat-pressing processes.
Implementation Method 1
a plurality of resin layers each made of thermoplastic that are laminated together
Implementation Method 2
a flow of resin may occur. In particular, a component embedded in a multilayer substrate is likely to be affected by a flow of resin to cause the component to be easily displaced
Data Source
AI summary
A component-embedded substrate includes a laminate and first and second components. The laminate includes resin layers each made of thermoplastic that are laminated together. The first and second components are embedded in the laminate. The first component has a length in the lamination direction that is greater than a length of the first component in a first direction orthogonal or substantially orthogonal to the lamination direction. The first and second components are disposed adjacent to each other in the first direction, and are disposed at respective positions overlapping with each other as viewed from the first direction. A distance between the first and second components in the first direction is less than the length of the first component in the lamination direction.