Embedded Trace Substrate Extended IMC Layer Structural Support
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Solution Overview
Problem
Thin traces in semiconductor device packages deform during molding processes due to lack of structural support, leading to increased package size and potential short circuits from solder bump land pad deformation and bridge formation.
Innovation Solution
Incorporating an extended intermetallic compound (IMC) layer by exposing a portion of a metallic foil adjacent to the solder land pads, allowing solder to wet both the land pad and the foil, forming an IMC that strengthens the connection and reduces electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a thin trace is used in the semiconductor package, then the package size can be minimized, but the trace deforms during molding process
Solution Approach 1:
The patent creates a composite structure by exposing a portion of the metallic foil adjacent to the solder land pad, forming an extended intermetallic compound (IMC) layer. This composite of the thin trace and extended IMC layer provides both the small size benefit of thin traces and the structural stability needed to prevent deformation during molding.
Solution Approach 2:
The patent segments the trace structure into two functional parts: the thin trace portion for maintaining small package size and the extended IMC layer portion for providing structural support. This segmentation allows each part to fulfill its specific function while working together as a unified structure.
2Volume of moving object
If a thin trace is used in the semiconductor package, then the package size can be minimized, but solder bump land pad deformation and bridge formation occur
Solution Approach 1:
The extended IMC layer creates a composite structure that reinforces the thin trace, preventing solder bump land pad deformation and bridge formation. This composite provides the mechanical strength needed to maintain reliability while keeping the package size small.
Solution Approach 2:
The patent performs preliminary action by pre-forming the extended IMC layer before the molding process. This pre-established structural support prevents deformation and bridge formation during subsequent molding operations, ensuring reliability before the harmful molding process occurs.
3Stability of the object's composition
If an extended IMC layer is formed by exposing metallic foil, then structural support is provided to prevent deformation, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the IMC layer formation process with the existing trace fabrication process. By exposing a portion of the metallic foil adjacent to the land pad during normal manufacturing steps, the extended IMC layer is created as an integrated part of the trace structure rather than as a separate additional process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides structural support to thin traces, preventing deformation and reducing the risk of short circuits, while allowing for smaller package sizes and improved electrical connections.
Implementation Method 1
allowing solder to wet both the land pad and the foil, forming an IMC that strengthens the connection and reduces electrical resistance
Implementation Method 2
allowing solder to wet both the land pad and the foil
Data Source
AI summary
A substrate structure includes a carrier, a first metal layer, a circuit layer and a dielectric layer. The carrier has a first surface and a second surface. The first metal layer is disposed on the first surface of the carrier. The circuit layer is disposed on the first metal layer. The dielectric layer covers the circuit layer and defines a plurality of openings to expose portions of the circuit layer and portions of the first metal layer.