Embedded Two-Phase Cooling Structure for Molded IC Packages
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Solution Overview
Problem
State-of-the-art mobile application devices face overheating issues due to multiple heat sources within a small form factor, which complicates thermal management and affects performance.
Innovation Solution
A packaged integrated circuit device with a semiconductor die thermally coupled to a sealed two-phase cooling structure, encapsulated in a mold compound, which includes a vapor chamber or heat pipes for improved thermal distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple heat sources are arranged within a small form factor to increase device functionality, then device capability is improved, but thermal management becomes more complex and overheating occurs
Solution Approach 1:
The patent combines multiple heat dissipation functions into a single integrated cooling structure that is embedded within the mold compound. This unified cooling system manages heat from multiple heat sources simultaneously, reducing thermal management complexity while maintaining the ability to handle multiple heat-generating components in a small form factor device.
Solution Approach 2:
The cooling structure acts as an intermediary between the heat-generating semiconductor die and the surrounding environment. By embedding the cooling structure within the mold compound, it serves as a thermal mediator that efficiently transfers heat away from sensitive components while being integrated into the existing device architecture, thus improving thermal management without adding external complexity.
2Productivity
If heat generation increases due to advanced processing, then device performance is improved, but overheating and thermal management issues worsen
Solution Approach 1:
The patent converts the harmful effect of increased heat generation into a benefit by designing a cooling structure that leverages the proximity of heat sources to efficiently capture and dissipate thermal energy. The embedded cooling structure is positioned to maximize thermal coupling with high-performance, high heat-generating components, transforming the heat problem into an opportunity for effective thermal management that supports sustained high performance.
3Temperature
If a cooling structure is added to manage heat, then thermal distribution is improved, but device complexity increases
Solution Approach 1:
The cooling structure is nested within the mold compound, which itself encloses the semiconductor die and other components. This nested arrangement allows the cooling system to be integrated into the existing device structure without adding external components or increasing overall device complexity. The cooling channels and heat dissipation pathways are embedded within the encapsulant material, creating a compact, multi-functional structure.
4Volume of moving object
If the form factor is reduced to meet mobile device requirements, then device portability is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent addresses heat dissipation in a reduced form factor by transitioning from external or topological cooling approaches to an embedded three-dimensional cooling structure. The cooling channels and thermal pathways are integrated within the vertical dimension of the mold compound, allowing efficient heat dissipation without increasing the device's external footprint. This dimensional integration enables effective thermal management within the constrained volume of mobile devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced thermal distribution and reduced heat generation, improving the performance of integrated circuit devices.
Implementation Method 1
a sealed two-phase cooling structure thermally coupled to the semiconductor die
Implementation Method 2
which includes a vapor chamber or heat pipes for improved thermal distribution
Implementation Method 3
a mold compound encapsulating the semiconductor die and the sealed two-phase cooling structure
Data Source
AI summary
A packaged integrated circuit device includes a semiconductor die. The packaged integrated circuit device also includes a sealed two-phase cooling structure thermally coupled to the semiconductor die. The packaged integrated circuit device further includes a mold compound encapsulating the semiconductor die and the sealed two-phase cooling structure.