Embedded Vialess Bridges for High-Density Interconnects
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Solution Overview
Problem
Conventional microelectronic substrates face challenges in achieving high-density wiring without compromising signal fidelity due to fine conduction lines and interference, and the cost of miniaturization is high, as the surface area becomes crowded with power and electrical ground connections.
Innovation Solution
Embedded vialess bridges with discrete pieces containing numerous conduction lines in a 3-dimensional structure are used to provide dense arrays of signal, power, and electrical ground wires below the surface of the main substrate, utilizing vertical conductors to connect dies and interconnect them, eliminating the need for fine surface traces and vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional miniaturization is used to achieve high density wiring on surface, then conductor count increases, but signal fidelity deteriorates due to fine traces and interference
Solution Approach 1:
The patent transitions from 2D surface wiring to 3D embedded wiring by placing conductive bridges within the substrate volume. This dimensional change allows wider conductor cross-sections while maintaining high density, as conductors are distributed through the thickness of the substrate rather than confined to the surface plane.
Solution Approach 2:
The conductive bridges are nested within the substrate structure, with multiple bridges embedded at different depths and orientations. This nesting approach allows high conductor density while providing physical separation between conductors, reducing interference and maintaining signal fidelity.
2Quantity of substance
If surface area is used for high density interconnects, then conductor count increases, but manufacturing cost increases due to miniaturization requirements
Solution Approach 1:
By utilizing the substrate thickness dimension for embedding conductive bridges, the patent avoids the need for extreme surface miniaturization. The bridges can be formed with larger cross-sections using standard manufacturing processes, reducing the cost associated with fine-line surface wiring and high-density interconnect fabrication.
3Adaptability or versatility
If power and ground connections are added to signal layers, then connectivity increases, but surface real estate becomes crowded
Solution Approach 1:
The patent distributes power, ground, and signal connections throughout the substrate volume using embedded bridges at multiple depths. This 3D arrangement allows all connection types to coexist without competing for surface area, as conductors are arranged in vertical and lateral dimensions within the substrate interior.
Solution Approach 2:
The substrate is segmented into multiple regions with embedded bridges at different locations and orientations. This segmentation allows independent routing of power, ground, and signal paths through different spatial zones, enabling high connectivity while maintaining adequate spacing between conductor groups.
Data Source
AI summary
Embedded vialess bridges are provided. In an implementation, discrete pieces containing numerous conduction lines or wires in a 3-dimensional bridge piece are embedded where needed in a main substrate to provide dense arrays of signal, power, and electrical ground wires below the surface of the main substrate. Vertical conductive risers to reach the surface plane of the main substrate are also included in the discrete piece, for connecting to dies on the surface of the substrate and thereby interconnecting the dies to each other through the dense array of wires in the discrete piece. The discrete piece to be embedded may have parallel planes of conductors at regular intervals within itself, and thus may present a working surface homogeneously covered with the ends of vertical conductors available to connect surface components to each other and to ground and power at many places along the embedded piece.