Embedded Waveguide Package Structure for Low-Loss RF Signals
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Solution Overview
Problem
Existing semiconductor device packages experience significant signal loss during the transmission of radio frequency signals due to inefficient waveguides, particularly at high frequencies.
Innovation Solution
Incorporation of a conductive lid within the substrate to define a waveguide that minimizes signal loss by restricting energy transmission in a specific direction, utilizing a cavity and conductive layers to guide electromagnetic waves efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional signal transmission methods are used in semiconductor device packages, then the structure is simple, but signal loss is significant especially at high frequencies
Solution Approach 1:
The waveguide structure is nested within the substrate by forming a conductive lid that defines a cavity inside the substrate. The cavity is embedded within the substrate material, creating a nested configuration where the waveguide path is integrated into the package structure rather than being external or surface-mounted.
Solution Approach 2:
The waveguide transmission transitions from traditional planar or surface-level signal paths to a three-dimensional cavity structure. The conductive lid forms a enclosed volume within the substrate, utilizing the third dimension (depth) to create a waveguide path that guides electromagnetic waves through the cavity volume rather than along surface traces.
2Reliability
If waveguide structure is implemented to reduce signal loss, then signal transmission efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The waveguide manufacturing process is merged with the existing substrate fabrication process. The conductive lid is formed using the same semiconductor manufacturing techniques already employed for creating the substrate, including depositing conductive layers and patterning. This integration allows the waveguide structure to be created alongside other package components in a unified manufacturing flow.
Solution Approach 2:
The conductive lid serves multiple functions simultaneously: it provides electromagnetic shielding, defines the waveguide cavity boundaries, and acts as part of the signal transmission path. This multi-functionality reduces the need for separate components and manufacturing steps, as the same structure performs multiple roles in both shielding and waveguide functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The waveguide design achieves low signal loss transmission, especially for high-frequency signals, by maintaining consistent power distribution and minimizing energy loss across the signal path.
Implementation Method 1
The conductive lid defines a waveguide having a cavity. The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.
Data Source
AI summary
A semiconductor device package includes a substrate and a conductive lid. The conductive lid is disposed within the substrate. The conductive lid defines a waveguide having a cavity. The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.