Embedded Wound Capacitor Structure for Shorter PCB Connections
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Solution Overview
Problem
Existing multilayer ceramic capacitors face challenges in miniaturization and high capacitance due to insufficient mounting space on printed circuit boards, and laser processing for via holes can damage electrodes and hinder signal transmission.
Innovation Solution
A capacitor component with a body having internal electrodes and dielectric layers wound in a cylindrical shape, connected by external electrodes on opposing surfaces, and embedded in a substrate with conductive layers, minimizing electrical connection paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser processing is used to form via holes for connecting capacitor external electrodes to conductive layers, then electrical connection is achieved, but manufacturing costs increase and external electrodes may be damaged
Solution Approach 1:
The patent extracts and eliminates the laser processing step from the manufacturing process. Instead of using laser to form via holes and fill with conductive material, the invention directly embeds the capacitor component into the substrate with external electrodes exposed on opposite surfaces, allowing direct electrical connection without the harmful laser processing step that could damage electrodes.
Solution Approach 2:
The capacitor component is designed with external electrodes disposed on opposite first and second surfaces of the body, segmenting the electrical connection points to both surfaces. This allows direct connection to conductive layers on respective surfaces without requiring through-substrate via holes, thereby eliminating laser processing damage while maintaining electrical connectivity.
2Reliability
If via holes are formed to connect capacitor external electrodes to conductive layers, then electrical connection is established, but connection path length increases reducing signal transmission characteristics
Solution Approach 1:
The patent removes the intermediate via hole structure from the electrical connection path. By embedding the capacitor with external electrodes exposed on both surfaces directly into the substrate, the connection path is shortened from a long route through via holes to a direct connection between external electrodes and conductive layers on adjacent surfaces.
3Volume of moving object
If mounting space on printed circuit board is limited, then capacitor size must be reduced, but achieving high capacitance in smaller size becomes difficult
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional embedding. The capacitor component is embedded within the substrate thickness direction, utilizing the Z-dimension for mounting space. The external electrodes on opposite surfaces connect to conductive layers on respective surfaces, effectively using the substrate's thickness to accommodate the capacitor while maintaining compact footprint.
Data Source
AI summary
A capacitor component, includes: a body including first and second surfaces opposing each other in a first direction, wherein, in the body, a first internal electrode, a second internal electrode, a first dielectric layer interposed between the first and second internal electrodes, and a second dielectric layer disposed on the second internal electrode are wound in the first direction as a winding axis; a first external electrode disposed on the first surface and connected to the first internal electrode; and a second external electrode disposed on the second surface and connected to the second internal electrode. The first internal electrode and the second internal electrode include different metals.