Embossed Heat Spreader Plate for Memory Module Thermal Management
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Solution Overview
Problem
Conventional heat spreader designs for memory modules face challenges in achieving effective heat dissipation and mechanical integrity while maintaining cost-effectiveness, and they often fail to perform well under varying airflow conditions due to reduced air velocity and bypassing airflow.
Innovation Solution
A heat spreader design incorporating a printed circuit board (PCB) with electronic components, a thermal interface material (TIM), and an embossed heat spreader plate that increases surface area for heat conduction and enhances rigidity, allowing for thinner materials and improved airflow dynamics through perforations and angled fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional heat spreader designs are used, then mechanical integrity is maintained, but heat dissipation performance is insufficient
Solution Approach 1:
The patent applies embossing to transform the flat two-dimensional heat spreader surface into a three-dimensional structure with raised patterns. This dimensional change increases the surface area available for heat dissipation while the embossed patterns themselves provide structural reinforcement that maintains mechanical integrity
Solution Approach 2:
The heat spreader is constructed as a composite structure combining a base material (such as PCB or metal plate) with embossed patterns that may involve different materials or structures. This composite approach allows optimization of both thermal performance and mechanical strength simultaneously
2Strength
If heat spreader thickness is increased to improve mechanical integrity, then rigidity is enhanced, but surface area for heat conduction is reduced
Solution Approach 1:
Instead of increasing thickness in the vertical dimension, the patent embosses patterns on the surface to increase area in the horizontal dimension. This allows the heat spreader to maintain thin profile while achieving both rigidity through the embossed structure and increased surface area for heat conduction
Solution Approach 2:
The embossed pattern divides the continuous surface into segmented raised regions and recessed areas. This segmentation increases the effective surface area for heat conduction while the raised segments provide structural rigidity, eliminating the need to increase overall thickness
3Adaptability or versatility
If airflow velocity is reduced due to module spacing variation, then system cost is reduced, but heat dissipation performance deteriorates
Solution Approach 1:
The embossed pattern changes the thermal conduction parameters by increasing surface area, which compensates for variations in convective heat transfer caused by airflow velocity changes. This allows the heat spreader to maintain effective heat dissipation across a range of airflow conditions without requiring active airflow control
Solution Approach 2:
The embossed heat spreader design serves multiple functions: it provides structural rigidity, increases surface area for heat conduction, and maintains effective heat dissipation across varying airflow conditions. This universal design works effectively whether modules are spaced closely or far apart, adapting to different system configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively increases heat dissipation surface area, enhances mechanical integrity, and maintains performance across varying airflow conditions, making it suitable for both high-density memory modules and cost-sensitive applications.
Implementation Method 1
a thermal interface material (TIM) thermally coupled to the electronic components
Implementation Method 2
a heat spreader plate thermally coupled to the TIM... adapted to dissipate thermal heat generated by the electronic components
Implementation Method 3
dissipate thermal heat generated by the electronic components... surface area available for heat conduction between the heat spreader plate and surrounding medium
Data Source
AI summary
One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.