Multi-Channel EMC Bracket for LED Color Temperature Control
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Solution Overview
Problem
Traditional multi-color temperature LED products require multiple LED packages, resulting in a larger product size, poor heat dissipation, and restrictive lens designs, limiting their versatility and efficiency.
Innovation Solution
A multi-color temperature and multi-channel EMC bracket structure featuring a metal substrate with multiple pads acting as electrodes, a cup-shaped insulating resin dam, and white resin partitions to divide the substrate into areas for independent LED chip circuits, allowing for thermoelectric separation and color temperature control without increasing the product size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple LED packages are combined to achieve multi-color temperature, then color temperature diversity is improved, but product size increases significantly
Solution Approach 1:
The patent merges multiple LED chips (different colors/temperatures) into a single integrated LED package structure. Multiple LED chips are mounted on one substrate and encapsulated together in one EMC package, allowing multi-color temperature functionality without increasing product size. This directly resolves the contradiction by combining what was previously separate packages into one unified structure.
Solution Approach 2:
The patent arranges multiple LED chips in a planar configuration on the substrate, utilizing two-dimensional space arrangement rather than stacking packages vertically or horizontally. This allows multiple color temperatures to coexist within the footprint of a single package, maintaining compact size while achieving color diversity through spatial arrangement on the same plane.
2Adaptability or versatility
If multiple LED packages are used for multi-color temperature, then color temperature control is improved, but heat dissipation performance deteriorates
Solution Approach 1:
By consolidating multiple LED chips into a single package with one common heat dissipation path through the substrate and EMC encapsulation, the patent creates unified thermal management. The heat from multiple chips is conducted through the substrate to the mounting board simultaneously, improving heat dissipation efficiency compared to separate packages where heat accumulates in isolation.
Solution Approach 2:
The substrate acts as an intermediary thermal conduction path between multiple LED chips and the mounting board. It provides a common thermal pathway that efficiently transfers heat from all LED chips to the heat sink, replacing the inadequate heat dissipation of individual packages with a coordinated thermal management system.
3Adaptability or versatility
If multiple LED packages are combined, then multi-color temperature functionality is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple LED chips, wiring connections, and encapsulation into a single integrated module. The substrate provides pre-designed circuit patterns that connect multiple chips, and one EMC encapsulation protects all components. This integration reduces the number of separate components and assembly steps compared to using multiple discrete packages, thereby reducing overall device complexity.
Solution Approach 2:
The single LED package structure serves multiple functions simultaneously: it houses multiple LED chips of different colors, provides electrical connections through the substrate, offers mechanical support, and provides optical encapsulation. This multi-functionality in a single structure reduces the need for separate components, simplifying the overall device architecture.
4Ease of manufacture
If traditional bracket structure is used with multiple packages, then manufacturing is simplified, but product strength and reliability deteriorate
Solution Approach 1:
The patent maintains the traditional bracket structure for mounting and manufacturing simplicity, but merges multiple LED chips into a single stronger encapsulated unit. The unified EMC package and substrate assembly create a more robust structure that resists mechanical stress better than multiple separate packages, improving reliability while preserving ease of manufacture through the familiar bracket interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the design of multi-color temperature products with traditional bracket appearances, improving production efficiency, product diversity, and heat dissipation, while maintaining a compact size and enhancing application markets.
Implementation Method 1
The spaces inside the cup-shaped insulating resin dam with respective to the different LED chip circuits are encapsulated by fluorescent layers respectively, and the fluorescent layer is located on the LED chip
Data Source
AI summary
A multi-color temperature and multi-channel EMC bracket structure comprises a metal substrate with more than three pads arranged on a periphery thereof as multi-block electrodes. A cup-shaped insulating resin dam is located on the metal substrate. Part of the pad is located inside the insulating resin dam and another part of the pad is located outside the insulating resin dam. At least one white resin partition is arranged inside the insulating resin dam to divide the metal substrate into multiple areas for arranging different LED chip circuits respectively. The LED chip circuit comprising a plurality of LED chips. The spaces inside the cup-shaped insulating resin dam with respective to different LED chip circuits are encapsulated by fluorescent layers respectively, and the fluorescent layer is located on the LED chip. The present invention can be controlled in regions to achieve the effect of different color temperature.