EMC Assembly With Retainer-Mediated PCB Force Distribution

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Solution Overview

Problem

Existing EMC assemblies face challenges in providing effective EMC protection for multiple PCBs while avoiding assembly errors and minimizing damage from excessive forces, particularly when using internal FIP gaskets, which can apply unwanted forces to the PCBs.

Innovation Solution

An EMC assembly design featuring a first and second electrically conductive elastic means compressing a PCB-retainer sandwich between two PCBs, with a retainer sandwiched in-between, equalizing forces and providing additional EMC shielding, mechanical stability, and thermal stress relief.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If internal FIP dispersed EMC gaskets are used as internal interface to PCB for EMC shielding, then EMC protection is improved, but unwanted forces are applied to the PCB that may cause damage

Engineering Contradiction:

ImproveEMC protectionVSAvoidunwanted forces on PCB

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A retainer component is introduced as an intermediary between the PCB and the elastic means. The retainer distributes and balances the compressive forces from the electrically conductive elastic means, preventing excessive localized forces from being applied directly to the PCB while maintaining EMC shielding effectiveness.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent modifies the mechanical parameters of the assembly by using elastic means with controlled compression properties. The elastic means are designed to provide sufficient compression for EMC shielding while the retainer ensures the force distribution remains within safe limits for the PCB, changing the force application parameters from direct to distributed.

Inventive Principle:

Principle #35Parameter changes

2Device complexity

If two PCBs are placed directly one above another in housing, then assembly simplicity is improved, but mechanical strength and stability are reduced

Engineering Contradiction:

Improveassembly structureVSAvoidmechanical strength of assembly

Core Design Contradiction:

Device complexityVSStrength

Solution Approach 1:

The patent combines multiple PCBs with a retainer component into a integrated sandwich assembly. This merging creates a mechanically stronger unit that can be handled and installed as a single assembly, improving overall mechanical strength while maintaining relatively simple assembly structure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The assembly creates a composite structure combining multiple PCBs and a retainer component into a sandwich configuration. This composite arrangement distributes mechanical loads across multiple layers, significantly increasing the overall mechanical strength and stability compared to individual PCBs.

Inventive Principle:

Principle #40Composite materials

3Reliability

If electrically conductive elastic means are used to secure PCBs in housing, then EMC properties are improved, but excessive compression forces may damage the PCB

Engineering Contradiction:

ImproveEMC propertiesVSAvoidPCB integrity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The retainer serves as a mediator between the electrically conductive elastic means and the PCB. It receives the compression forces from the elastic means and distributes them evenly across the PCB surface, preventing excessive localized forces that could damage the PCB while maintaining the necessary compression for EMC properties.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The retainer provides beforehand cushioning by being positioned between the elastic means and the PCB before compression is applied. This pre-positioned protective element ensures that even if compression forces vary, the PCB is protected from excessive forces while still allowing the elastic means to provide adequate compression for EMC shielding.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design securely holds PCBs together, preventing excessive bending and damage, while maintaining EMC integrity under harsh conditions, and enhancing mechanical strength and thermal stability.

Implementation Method 1

a first electrically conductive elastic means; a second electrically conductive elastic means; wherein the first electrically conducting elastic means and the second electrically conductive elastic means compress the PCB-retainer sandwich in-between themselves

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentEP4637289A1EMC assembly

Publication Date: 2025.10.22 APTIV TECHNOLOGIES AG

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AI summary

EMC assembly 1, comprising a first electrically conductive housing part 10 with a first electrically conductive elastic means 12, a second electrically conductive housing part 20 with a second electrically conductive elastic means 22, a first printed circuit board PCB 40 and a second printed circuit board PCB 50, a retainer 30 being sandwiched between the first printed circuit board 40 and the second printed circuit board 50 and forming a PCB-retainer sandwich 60, wherein the first electrically conductive elastic means 12 and the second electrically conducting elastic means 22 compress the PCB-retainer sandwich 60 in-between themselves.