EMI Attenuating Plastic Structures for Transceiver Modules
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Solution Overview
Problem
Traditional optoelectronic modules with EMI absorbers are expensive and face difficulties in molding complex three-dimensional features, limiting their effectiveness and increasing manufacturing costs.
Innovation Solution
The use of injection molded EMI plastic materials, such as those with nickel-coated carbon fiber or stainless steel fillers, to form EMI attenuating components that can be shaped to conform to complex contours, reducing manufacturing costs and improving EMI absorption capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional EMI absorbers are used in optoelectronic modules, then EMI attenuation is achieved, but manufacturing cost increases and complex three-dimensional features cannot be molded
Solution Approach 1:
The patent uses composite plastic materials containing conductive fillers (such as carbon fiber, metal particles, or metal-coated fibers) embedded in a plastic matrix to create EMI attenuating components. This composite approach provides both EMI shielding capability and moldability into complex three-dimensional shapes, resolving the contradiction between EMI attenuation performance and manufacturing ease.
Solution Approach 2:
The patent changes the material parameters by incorporating conductive fillers with specific properties (conductivity, size, shape, concentration) into the plastic material. By adjusting these parameters, the material achieves desired EMI attenuation levels while maintaining processability for injection molding into complex geometries, thus solving both EMI protection and manufacturing complexity issues.
2Adaptability or versatility
If complex three-dimensional EMI attenuating components are molded, then design flexibility improves, but traditional molding processes face difficulties
Solution Approach 1:
The patent employs injection molding technology to create EMI attenuating components with complex three-dimensional geometries, including thin-walled structures and intricate features. The injection molding process allows for flexible design adaptation while maintaining manufacturing feasibility, enabling complex shapes that traditional molding processes cannot achieve.
Solution Approach 2:
The use of composite plastic materials with conductive fillers enables the injection molding of complex three-dimensional EMI attenuating components. The plastic matrix provides moldability and flexibility for complex geometries, while the conductive filler network maintains EMI shielding effectiveness throughout the complex structure, resolving the contradiction between design flexibility and molding capability.
3Object-affected harmful factors
If EMI attenuating components are integrated into optoelectronic modules, then EMI management improves, but component placement and assembly complexity increase
Solution Approach 1:
The patent integrates EMI attenuating features directly into existing structural components of the optoelectronic module, such as housing parts, mounting brackets, or support structures. By merging EMI attenuation functionality with structural elements, the design reduces the number of separate EMI-specific components and simplifies assembly, while still achieving comprehensive EMI management throughout the module.
Solution Approach 2:
The EMI attenuating components are designed to serve multiple functions: providing EMI shielding, maintaining structural support, enabling component mounting, and facilitating heat dissipation. This multi-functionality reduces the overall component count and assembly complexity, as single components perform multiple roles, thereby improving EMI management without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in more cost-effective and flexible designs for optoelectronic modules with enhanced EMI absorption, simplifying manufacturing processes and allowing for more complex shapes, while maintaining the overall size and structure of existing products.
Implementation Method 1
The EMI attenuating component may be formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component may be configured to attenuate EMI generated by one or more other components of the optoelectronic module.
Data Source
AI summary
An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.