Conductive Frame EMI Shield for Compact Semiconductor Packages
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Solution Overview
Problem
The increasing complexity and miniaturization of semiconductor devices lead to higher electromagnetic interference (EMI), which traditional EMI shielding methods, such as conductive casings, cannot effectively address without increasing the package size, posing challenges for high-density integrated circuits.
Innovation Solution
A semiconductor device package design incorporating a substrate, electrical components, a conductive frame with openings, and an electromagnetic interference (EMI) shield that is grounded through a connection member, allowing for effective EMI reduction while maintaining a compact size by exposing components and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductive casing is used for EMI shielding, then EMI protection is improved, but package size increases
Solution Approach 1:
The conductive casing is segmented into a frame structure with multiple conductive elements (first conductive element, second conductive element, third conductive element) positioned at different locations. This segmentation allows the EMI shielding function to be distributed across multiple smaller conductive components rather than requiring a complete enclosing casing, thereby reducing overall package size while maintaining EMI protection effectiveness.
Solution Approach 2:
The conductive frame structure is integrated within the package substrate, with conductive elements nested among the electrical components. The first conductive element is positioned near the first electrical component, the second conductive element near the second electrical component, and the third conductive element connects to ground. This nesting approach allows EMI shielding functionality to be embedded within the existing package architecture without adding significant external volume.
2Object-affected harmful factors
If EMI shielding is added, then electromagnetic interference reduction is improved, but manufacturing complexity increases
Solution Approach 1:
The EMI shielding function is merged with the existing electrical components and substrate structure. The conductive elements are integrated into the package alongside the electrical components, with the third conductive element providing ground connection. This merging eliminates the need for separate EMI shielding assemblies and reduces manufacturing steps compared to adding a complete conductive casing.
Solution Approach 2:
EMI shielding is applied locally at specific locations where electrical components are positioned, rather than providing uniform shielding throughout the entire package. The first conductive element provides shielding near the first electrical component, the second conductive element near the second electrical component, and the third conductive element provides ground reference. This localized approach reduces material usage and simplifies manufacturing compared to complete package encasement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI without increasing the package size, enhancing the operational stability of neighboring semiconductor devices and lowering manufacturing costs by optimizing the placement and structure of the EMI shield and conductive frame.
Implementation Method 1
When electromagnetic emissions from an interior of the package strike an inner surface of the casing, at least a portion of these emissions can be electrically shorted, thereby reducing the level of emissions that can pass through the casing and adversely affect neighboring semiconductor devices.
Implementation Method 2
shielding can be accomplished by including an electrically conductive casing or housing that is electrically grounded and is secured to an exterior of the package
Data Source
AI summary
A semiconductor device package includes a substrate, electrical components disposed on the substrate, and a conductive frame disposed on the substrate. The conductive frame includes a top portion including at least one opening, a rim connected to the top portion and surrounding the electrical components, and a compartment extending from the top portion of the conductive frame and separating one or more of the electrical components from others of the electrical components. The semiconductor device package further includes an electromagnetic interference shield in contact with the top portion and the rim of the conductive frame.