Ultra-thin EMI Shield Package Using Conductive Encapsulation
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Solution Overview
Problem
Existing electronic packages are too thick, have poor electromagnetic interference shielding, and inefficient heat dissipation, leading to performance degradation and increased costs due to the use of metal casings.
Innovation Solution
A method to fabricate a thin electronic package with an electromagnetic interference shield layer using a conductive encapsulate material, such as graphene or permalloy, that also enhances heat dissipation by forming a conductive path for heat release, while reducing package thickness and complexity through trimming and grinding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal casing is used to minimize electro-magnetic interference and improve heat dissipation, then shielding effect and heat dissipation are improved, but cost and size increase
Solution Approach 1:
The patent uses a thin film EMI shield layer (0.5-5 micrometers thick) deposited on the substrate instead of bulky metal casings. This thin film provides effective electro-magnetic interference shielding while maintaining a compact package size, directly resolving the contradiction between shielding effectiveness and package volume.
Solution Approach 2:
The patent employs composite material structures including the EMI shield layer combined with thermally conductive encapsulation materials containing fillers such as aluminum oxide, aluminum nitride, or boron nitride. This composite approach achieves both shielding and heat dissipation functions without requiring separate metal casing components, reducing overall package size.
2Temperature
If metal casing is used to improve heat dissipation, then thermal management is improved, but cost increases
Solution Approach 1:
The patent replaces expensive metal casings with thin film EMI shield layers that can be deposited using cost-effective techniques such as sputtering or chemical vapor deposition. These thin films provide adequate heat dissipation pathways when combined with thermally conductive encapsulation materials, significantly reducing manufacturing cost while maintaining thermal management performance.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the encapsulation material by incorporating high thermal conductivity fillers (aluminum oxide, aluminum nitride, boron nitride) into the encapsulation compound. This allows the encapsulation material itself to serve as a heat dissipation pathway, eliminating the need for expensive metal heat sinks or casings.
3Reliability
If conventional electro-magnetic interference shielding structures are used, then shielding function is provided, but structure complexity and thickness increase
Solution Approach 1:
The patent merges multiple functions into a single integrated structure: the EMI shield layer is deposited directly on the substrate and serves both as an electro-magnetic interference barrier and as part of the thermal management system when combined with thermally conductive encapsulation materials. This integration eliminates the need for separate shielding cans, gaskets, and thermal management components, dramatically simplifying the overall structure.
Solution Approach 2:
The patent uses a thin film EMI shield layer (0.5-5 micrometers) instead of thick conventional shielding structures. This thin film provides effective electro-magnetic interference shielding while adding minimal thickness to the package and requiring no complex assembly steps, thus reducing both structural complexity and overall package thickness.
4Length of stationary object
If chip thickness is reduced for thinner packages, then package thickness is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent uses a thin film EMI shield layer that serves dual purposes: providing electro-magnetic interference shielding and acting as a thermal management interface. Even though the chip is thinned, the thin film structure maintains effective thermal contact with the substrate and provides adequate heat dissipation pathways through its high surface area to volume ratio.
Solution Approach 2:
The patent employs thermally conductive encapsulation materials with high thermal conductivity fillers (aluminum oxide, aluminum nitride, boron nitride) that compensate for the reduced chip thickness. These composite materials create efficient heat dissipation pathways from the thinned chip to the substrate, maintaining thermal performance despite the reduced chip thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective electromagnetic interference shielding and improved heat dissipation, reducing package size and cost while maintaining performance, by forming a thin semiconductor chip with a conductive encapsulate material that serves as both a shield and heat dissipation path.
Implementation Method 1
improved heat dissipation, reducing package size and cost while maintaining performance, by forming a thin semiconductor chip with a conductive encapsulate material that serves as both a shield and heat dissipation path
Implementation Method 2
form an electro-magnetic interference shield layer over the encapsulated semiconductor chip
Data Source
AI summary
A method to fabricate an electronic package is described and includes the steps of: connecting a plurality of semiconductor chips to at least one surface of a substrate using a connect pad; encapsulating the semiconductor chips with a non-conductive material; and forming an electro-magnetic interference shield layer over the encapsulated semiconductor chip.