EMI Shield Integrated in Redistribution Structure for Imaging Die
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Solution Overview
Problem
Current microelectronic imagers are sensitive to background electromagnetic radiation, leading to image distortion or pixel blackout due to thermally emitted charges, and existing EMI shielding structures are large, increasing the device footprint, which is undesirable for portable devices.
Innovation Solution
Integration of a compact EMI shield within the redistribution structure of the microelectronic device, positioned between the imaging die and optics assembly, using conductive materials to block electromagnetic radiation and attenuate fields, while maintaining a compact footprint by not exceeding the size of the die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal housing EMI suppressing structure is used, then electromagnetic interference protection is improved, but device footprint increases
Solution Approach 1:
The EMI shield is merged with the redistribution structure, combining two separate functions (EMI shielding and signal redistribution) into a single integrated component. This eliminates the need for a separate metal housing while maintaining EMI protection, thereby reducing the device footprint.
Solution Approach 2:
The redistribution structure serves multiple functions: it redistributes electrical signals and simultaneously provides EMI shielding. This multi-functionality allows the device to achieve electromagnetic interference protection without adding extra components that would increase the footprint.
2Reliability
If EMI suppressing structures are added, then image quality is improved, but device complexity increases
Solution Approach 1:
By combining the EMI shield with the redistribution structure, the patent reduces structural complexity while maintaining image quality. The merged structure eliminates the need for separate EMI shielding components, simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electromagnetic interference, preventing image distortion and pixel blackout while minimizing the device's footprint, making it more suitable for use in portable devices like cell phones and cameras.
Implementation Method 1
an EMI shield 160 formed in the redistribution structure 150... positioned between the imaging die and optics assembly... using conductive materials to block electromagnetic radiation and attenuate fields
Data Source
AI summary
Microelectronic devices having an EMI shield, systems including such microelectronic devices, and methods for manufacturing such microelectronic devices. One embodiment of a microelectronic device comprises an imaging system comprising a microelectronic die, an optics assembly, and an electromagnetic interference (EMI) shield. The microelectronic die includes an image sensor, processing components electrically coupled to the image sensor, a first interconnect electrically isolated from the processing components, and a second interconnect electrically coupled to the processing components. The optics assembly is aligned with the image sensor, and the electromagnetic interference (EMI) shield is between the optics assembly and the processing components. The EMI shield is electrically coupled to the first interconnect.