EMI Shielded Packages Using Conductive Paste and Solid Conductor
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Solution Overview
Problem
Existing methods for forming electromagnetic interference (EMI) shields for electronic device packages are complex, expensive, and space-intensive, failing to effectively isolate sensitive RF and digital components from interfering fields.
Innovation Solution
A method involving applying an insulating material to a substrate strip with electronic circuitry, separating it into segments, adhering the insulating material to a solid conductor, applying a conductive paste around the segments, curing it, and cutting through to form EMI shielded packages, which electrically isolates and connects the circuitry to ground, creating a Faraday cage-like effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional EMI shielding methods are used, then electromagnetic interference is reduced, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the EMI shielding function from complex traditional methods and implements it through a simple ground plane layer formed by screen printing conductive paste on the PCB substrate. This eliminates the need for separate EMI shield components and complex assembly processes, reducing manufacturing complexity while maintaining EMI protection.
Solution Approach 2:
The patent uses inexpensive conductive paste materials and standard PCB fabrication processes instead of expensive EMI shield materials and complex manufacturing methods. The ground plane layer is created using cost-effective screen printing technology, significantly reducing manufacturing costs while providing adequate EMI shielding for the application.
2Object-affected harmful factors
If traditional EMI shielding methods are used, then electromagnetic interference is reduced, but manufacturing cost increases
Solution Approach 1:
The patent merges the EMI shielding function with the PCB ground plane, combining multiple functions into a single integrated structure. The ground plane serves both as an electrical reference plane and as an EMI shield, eliminating the need for separate EMI shield components and reducing overall manufacturing cost.
Solution Approach 2:
The patent uses inexpensive conductive paste materials and standard PCB fabrication processes instead of expensive EMI shield materials and complex manufacturing methods. The ground plane layer is created using cost-effective screen printing technology, significantly reducing manufacturing costs while providing adequate EMI shielding.
3Object-affected harmful factors
If traditional EMI shielding methods are used, then electromagnetic interference is reduced, but space requirements increase
Solution Approach 1:
The patent merges the EMI shielding function with the PCB ground plane, combining multiple functions into a single integrated structure. The ground plane serves both as an electrical reference plane and as an EMI shield, eliminating the need for separate EMI shield components and reducing overall space requirements.
Solution Approach 2:
The ground plane layer performs multiple functions simultaneously: it provides electrical reference for circuit operation, serves as an EMI shield to protect sensitive components, and acts as a return path for signal currents. This multi-functionality reduces the need for additional dedicated EMI shielding structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in efficient, cost-effective, and less intrusive EMI shielding that is simpler and more space-efficient than traditional methods, effectively reducing electromagnetic interference without the need for expensive sputtering processes or bulky metal shields.
Implementation Method 1
The insulating material electrically insulates the electronic circuitry from the solid conductor
Implementation Method 2
The conductive paste electrically connects the solid conductor to a conductive terminal exposed on at least one lateral side of each of the plurality of segments
Implementation Method 3
adhering the insulating material of the segments to a solid conductor... creating a Faraday cage-like effect
Data Source
AI summary
Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.