Spatially Selective Encapsulant Roughening for Adhesion
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Solution Overview
Problem
Conventional electronic components face challenges in ensuring reliable connection and adhesion between different encapsulants, leading to potential delamination and reduced reliability, especially under thermal and mechanical stress.
Innovation Solution
The electronic component features a spatially selectively roughened surface of the encapsulant, which increases the connection surface area and adhesion strength by incorporating a functional structure such as a thermal interface material, and additional treatments like plasma activation to prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a smooth surface of encapsulant is used, then the manufacturing process is simple, but the adhesion strength between encapsulant and functional structure is insufficient
Solution Approach 1:
The patent applies local quality by selectively roughening only specific surface regions of the encapsulant where functional structures will be placed, rather than treating the entire surface. This localized roughening creates anchor points for improved adhesion while keeping other areas smooth for their intended functions, thus resolving the contradiction between adhesion strength and manufacturing simplicity.
2Reliability
If the connection surface area is increased, then the adhesion reliability improves, but the manufacturing complexity increases
Solution Approach 1:
The patent implements preliminary action by forming the roughened surface pattern on the encapsulant before applying the functional structure. This pre-prepared surface topology ensures maximum contact area and mechanical interlocking capability before the functional material is deposited, thereby improving adhesion reliability without requiring complex post-assembly adjustments.
3Strength
If a roughened surface is created, then the mechanical coupling and resistance to delamination improve, but the manufacturing process becomes more complex
Solution Approach 1:
The patent replaces complex mechanical surface treatment processes with a chemical or photonic etching method that can be integrated into existing semiconductor manufacturing workflows. This substitution achieves the desired surface roughening for mechanical coupling while maintaining ease of manufacture by using established fabrication techniques rather than introducing new mechanical processing equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the mechanical and thermal reliability of the electronic component by improving adhesion between the encapsulant and functional structures, ensuring long-term functionality and preventing delamination.
Implementation Method 1
Roughening a connection surface of the encapsulant increases the mutual connection surface area and also provides additional grip so that a clawing effect between encapsulant and functional structure may further suppress the tendency of delamination under stress
Implementation Method 2
additional treatments like plasma activation to prevent delamination
Data Source
AI summary
An electronic component which comprises an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating at least part of at least one of the carrier and the electronic chip, and a functional structure covering a surface portion of the encapsulant, wherein at least part of the covered surface portion of the encapsulant is spatially selectively roughened.