Encapsulated Electronic Device Sealing via Surface Energy Segmentation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for protecting electronic devices from environmental contaminants like moisture and gases are inadequate, particularly in sealing areas where active materials can be difficult to remove, leading to incomplete or leaky seals and device degradation.

Innovation Solution

A process involving the formation of a discontinuous pattern of material with a specific surface energy on sealing areas, followed by the application of active layers via liquid deposition, and subsequent encapsulation using an assembly that bonds to the substrate, ensuring a clean and effective seal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If active materials are applied by liquid processing techniques, then the active layers can be formed effectively, but the materials are deposited in the sealing areas as well and are difficult to remove

Engineering Contradiction:

Improveactive layer formationVSAvoidsealing area cleanliness

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The sealing area is segmented into a discontinuous pattern of protrusions, creating distinct regions that prevent liquid material deposition while maintaining overall sealing functionality. This segmentation allows the sealing area to be differentiated from active areas, enabling clean seals without requiring complete material removal.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The sealing area is given a different local quality through the discontinuous protrusion pattern, creating regions with varying surface properties. This local differentiation ensures that liquid processing materials are deposited only in appropriate areas while sealing regions remain clean, eliminating the need for post-deposition cleaning.

Inventive Principle:

Principle #3Local quality

2Reliability

If the sealing area is cleaned prior to bonding, then a continuous seal can be achieved, but the cleaning process is required to remove deposited materials

Engineering Contradiction:

Improveseal continuityVSAvoidcleaning process requirement

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The discontinuous protrusion pattern is formed in advance on the sealing area, creating a pre-configured surface that inherently prevents liquid material deposition. This preliminary structural preparation eliminates the need for subsequent cleaning operations to achieve seal continuity, as the pattern itself ensures material exclusion during the deposition process.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If a continuous seal is formed, then leak-free encapsulation is achieved, but active materials must be completely removed from sealing areas

Engineering Contradiction:

Improveencapsulation integrityVSAvoidmaterial removal difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The sealing area is divided into discontinuous protrusions that create physical barriers preventing liquid material flow into sealing regions. This segmentation maintains the continuity and integrity of the final seal while eliminating the need for difficult material removal processes, as the patterned structure inherently excludes materials during deposition.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The potential harm of liquid materials depositing in sealing areas is converted into a benefit by using the same liquid processing technique to create the discontinuous protrusion pattern. This pattern then serves as a permanent barrier against future material deposition, transforming the deposition issue into a solution mechanism.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This process effectively encapsulates electronic devices, preventing contamination and ensuring a continuous, leak-free seal by using a discontinuous pattern to contain the liquid composition and maintain the integrity of the active layers, thereby enhancing device performance and longevity.

Implementation Method 1

forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, wherein at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy

Methodology Applied

Scientific EffectSurface energy: Surface Tension

Implementation Method 2

bonding the encapsulation assembly to the substrate in the sealing areas

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS7947536B2Process for forming encapsulated electronic devices

Publication Date: 2011.05.24 LG CHEM LTD

AI summary

There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.