Display Encapsulation Bridge Separation to Prevent Glass Fragments
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Solution Overview
Problem
The manufacturing process of display devices often results in defects caused by fine glass fragments generated during physical processing of encapsulation substrates, which can lead to reliability issues.
Innovation Solution
A method involving forming a light emitting element layer on a mother substrate, creating a through portion in a dummy area of a preliminary encapsulation substrate to form a bridge, bonding the substrates, applying a sealing member, and cutting the bridge to separate the dummy area, thereby preventing the accumulation of fine glass fragments without using physical processing methods like diamond wheels or dicing saws.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If physical processing methods (diamond wheel or dicing saw) are used to separate the dummy area from the cell area, then the encapsulation substrate can be divided, but fine glass fragments are generated and remain on the encapsulation substrate causing defects
Solution Approach 1:
The dummy area and cell area are connected by a narrow bridge structure that allows selective separation. The bridge is designed with specific dimensions (width of 3-10 μm, length of 50-200 μm) to enable clean separation without generating fragments, dividing the encapsulation substrate into functional segments that can be processed independently
Solution Approach 2:
The patent replaces traditional mechanical cutting methods (diamond wheel or dicing saw) with a separation process that applies controlled impact forces through the bridge structure. This substitution eliminates the need for abrasive mechanical cutting that generates fine glass fragments, achieving separation through structural weakness exploitation rather than forceful cutting
2Reliability
If the dummy area is completely separated from the cell area, then processing defects are eliminated, but the structural integrity during manufacturing is compromised
Solution Approach 1:
The bridge structure is pre-formed during the encapsulation substrate manufacturing process, creating a predetermined separation path before the actual separation occurs. This preliminary structural design ensures that when separation is needed, it occurs cleanly along the bridge without compromising the integrity of the main cell area during subsequent manufacturing steps
Solution Approach 2:
The bridge acts as an intermediary structure connecting the dummy area and cell area. It provides mechanical support and structural integrity during manufacturing while being designed to fail cleanly at a specific location, serving as a controlled weak point that mediates between the need for separation and the need for structural strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances process reliability by eliminating the risk of fine glass fragments on the encapsulation substrate, improving the manufacturing process and reducing defects in display devices.
Implementation Method 1
the method may further include strengthening the preliminary encapsulation substrate through an ion exchange process between the forming of the through portion in the dummy area and the cutting of the at least one bridge
Data Source
AI summary
A method of manufacturing a display device includes forming a light emitting element layer on a mother substrate, forming a through portion in a dummy area of a preliminary encapsulation substrate to form at least one bridge connecting a cell area of the preliminary encapsulation substrate and the dummy area adjacent to the cell area, bonding the mother substrate and the preliminary encapsulation substrate, applying a sealing member through the through portion, the sealing member extending from an upper surface of the mother substrate to a side surface of the preliminary encapsulation substrate which is exposed by the through portion, and cutting the at least one bridge and separating the dummy area of the preliminary encapsulation substrate.