Laser Beam Welding Apparatus TRIZ Cases

Patterning the light emitting stack and electrode edge blocks lateral moisture paths and helps prevent micro cracks around hole-in displays.

Using a liquid-assist medium and multiphoton laser beamlets, this case cuts transparent dielectrics with less thermal damage and cleaner high-aspect-ratio features.

A controlled SAXS slope in PBT polyester raises near-infrared laser transmittance and lowers electromagnetic wave transmission loss.

A Venturi welding cover creates localized vacuum with brush packs and sealing lips to weld thick aluminum blocks across uneven edges.

Timed power supply and beam redirection maintain laser processing quality while cutting energy use and reducing wasted optical output.

A stepped light emitting stack, electrode patterning layer, and dam structure block lateral moisture and micro cracks around display through-holes.

Stored scan-position intensity trends correct plasma, thermal, and reflected light signals for more accurate laser welding state monitoring.

Processing marks on an inspection substrate reveal laser scanner stains or deterioration before lift-off, helping avoid buffer-layer break failures.

Angular phase segmentation shapes laser beams into elongated, diffraction-free focus zones for precise processing of transparent materials.

Layered 2D laser ablation paths cut thick materials faster while limiting thermal damage and improving side-wall verticality.

Dynamic focal-position control matches complex weld shapes to improve penetration, bonding strength, and spatter suppression.

Laser welding joins transmissive and absorptive imaging module parts without adhesives, improving assembly precision and durability in severe use.

Asymmetric 2D beam scanning tailors heat across the weld seam to handle part variations while maintaining weld quality at higher speed.

A movable gas nozzle tracks laser scanning to keep gas flow effective for blowing spatter from processing grooves and improving weld quality.

Side-drawn airflow, a solid top, and passthrough curtains help contain laser energy while improving fume removal and alignment precision.

A spatial light modulator spaces branched focal points to cut parallel grooves independently, reducing interference and heat-affected zones.

Automatic corner recognition and nozzle selection keep laser beam alignment accurate across part size variations without manual repositioning.

A defocused laser beam and PSD sensing calibrate galvanometer-to-XY stage offsets quickly, avoiding slow offline measurement and beam damage.

Rotating half-wave plates and Wollaston prisms splits laser energy into adjustable beams, shortening wafer machining time while limiting heat impact.

Spatially resolved detection of reflected and refracted laser light enables compact, real-time control of direct interference structuring.

Multiple split light beams with tuned intensity, phase, and polarization form riblets more precisely to cut friction and turbulent drag.

Gas bubble detection lets liquid-phase laser processing avoid beam reflection and diffraction, improving cut quality and processing speed.

Adaptive threshold updates track changing laser process conditions to improve cut-break detection and prevent false malfunction signals.

A low-power return-pass scan checks the cut line for miscuts, enabling targeted parameter adjustment and re-cutting with less wasted time.

Masking the beam path at the wafer edge keeps side-entry intensity below threshold, improving modified layer uniformity and crack control in GaN wafers.

Alternating laser passes across second dicing lines keep narrow strips aligned, enabling accurate chip separation with less device damage.

Machine vision detects toolpath-to-gap deviation and rotates the fixture in real time to keep laser welding aligned on complex 3D parts.

Tilting the laser housing instead of the support roll keeps focus uniform across the scan while preventing steel sheet meandering and fracture.

Shape measurement and penetration-depth calculation set shot counts by surface inclination, improving subtractive machining precision with less waste.

Negative-curvature hollow core fiber delivers high-energy UV, near-IR, and IR laser pulses with lower degradation, bending loss, and better flexibility.

Mirror correction offsets fθ lens chromatic aberration so processing and measurement beams stay aligned for accurate keyhole depth sensing.

Pulsed laser channels with a local width maximum improve substance uptake and controlled release while preserving metal substrate stability.

Patterned electrodes split across two substrates form closed images in switchable windows without complex contacting or visible gaps.

A phase compensation sheet corrects beam distortion in inclined laser drilling, improving focus accuracy, process quality, and fabrication speed.

Thermal repair and dual-side light injection help TOPCon substrates withstand laser grooving, improving PN junction quality and cell efficiency.

Telecentric lens control widens multi-beam spacing to limit HAZ, flatten groove bottoms, and reduce sidewall taper at high forming speed.

A transmissive glass MEMS mirror passes residual radiation through the substrate to limit heating, phase shift, and imaging loss in Lissajous laser machining.

A carrier substrate transfers diced epitaxial dies onto display cell areas to improve wafer use, cut cost, and reduce alignment errors.

Splitting one laser into multiple focused beams speeds thin-film solar cell scribing while maintaining line straightness, parallelism, and dust removal.

A shifting frequency-comb sensor replaces motorized OCT reference arms to deliver wider-range, high-resolution distance measurement in laser processing.

Rotatable gates inside a laser-safe enclosure block reflected beams during marking while letting conveyed parts pass without stopping the line.

Wavefront modulation shifts the processing laser focus independently of measurement light, extending autofocus depth without complex lens actuators.

A movable lens in the laser head induces beam wobbling to widen weld tracks, reduce spatter, and avoid scanner or mirror cost.

Automatic laser power adjustment tracks manual speed reductions in beam processing to protect machine components and maintain reliable cutting.

A moving pattern mask segments laser exposure across uneven metal thickness to form display interconnect patterns without substrate damage.

Inclined magnetic coupling with spring-loaded pins lets a separable laser head recouple accurately after impact, preserving processing quality.

Camera-based detection identifies lens and nozzle codes on the focusing unit, enabling automatic parameter setup and fewer replacement errors.

Continuous beam-profile detection and mirror-lens adjustment reduce optical path deviation effects and keep laser processing consistent.

Segment-specific beam shaping matches each cutting path to workpiece properties, improving kerf control, heat management, and feed rate.

A bridge-shaped through portion enables clean dummy-area separation and sealing, preventing glass fragments that can cause display defects.