Imaging Module Laser Welding for Precise Adhesive-Free Assembly

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Solution Overview

Problem

The accuracy and reliability of imaging module assembly are critical for achieving high image quality, especially in on-vehicle cameras where driving assistance depends on it. Existing assembly methods may not adequately address the need for precise and reliable component joining.

Innovation Solution

The proposed imaging module employs a laser welding method using light transmissive and light absorptive members with different transmittance levels. This method allows for the components to be welded together without adhesives, ensuring a strong and reliable joint while maintaining the assembly's precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If adhesive joining is used to assemble components, then assembly is facilitated, but reliability and durability deteriorate in severe use environments

Engineering Contradiction:
Improveassembly facilitationVSAvoidreliability in severe use environments
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces adhesive joining (chemical bonding system) with laser welding (thermal/energy-based system). The laser beam directly melts and fuses the component materials, creating a metallurgical bond that is superior to adhesive bonding in terms of strength and reliability under severe conditions such as high temperature, vibration, and humidity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the joining mechanism from low-energy adhesive bonding to high-energy laser welding. By controlling laser parameters (power, pulse duration, focal position) and material properties (absorptivity, thermal conductivity), the process achieves precise local melting and fusion, creating strong joints that maintain reliability in severe environments while facilitating assembly automation.

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If conventional assembly methods are used, then manufacturing process is simple, but manufacturing precision deteriorates

Engineering Contradiction:
Improveassembly process complexityVSAvoidassembly accuracy
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical assembly methods (screws, clips, adhesives) with laser welding, which provides non-contact, precise energy delivery. The laser beam can be precisely positioned and controlled to weld components at exact locations with high accuracy, achieving manufacturing precision that exceeds conventional mechanical assembly methods.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention utilizes controllable laser parameters (power, pulse width, scanning speed, focal position) to achieve precise heating and melting only at the joint interface. This localized energy input allows for high-precision joining without affecting surrounding areas, maintaining component integrity and assembly accuracy even as the process becomes more sophisticated.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The laser welding method facilitates easy assembly by reducing the number of components and eliminating the need for adhesives, thereby enhancing the reliability and durability of the imaging module, especially in severe use environments like on-vehicle cameras.

Implementation Method 1

a laser beam is applied toward a light absorptive member from a light transmissive member, thereby heat is generated in the light absorptive member, and the light absorptive member is joined to the light transmissive member

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 2

the second component has a lower light transmittance... a laser beam is applied toward a light absorptive member from a light transmissive member, thereby heat is generated in the light absorptive member

Methodology Applied
Scientific EffectLight absorption: Absorption (EM radiation)

Data Source

PatentUS20250150693A1Imaging module and assembly method
Publication Date: 2025.05.08 PANASONIC AUTOMOTIVE SYST CO LTD
  • US20250150693A1 patent drawing
  • US20250150693A1 patent drawing
  • US20250150693A1 patent drawing

AI summary

An imaging module according to the present disclosure includes a plurality of components. The imaging module includes a first component and a second component. The first component has a higher light transmittance. The second component has a lower light transmittance. A joint is included in the first component and the second component.