Pattern-Mask Laser Irradiation for Non-Uniform Metal Layer Patterning
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Solution Overview
Problem
Existing laser irradiation devices face challenges in minimizing damage to substrates during the patterning process of display devices, particularly when dealing with metal layers of non-uniform thickness.
Innovation Solution
A laser irradiation device is designed to pattern a metal layer overlapping pad and bump electrodes on a substrate using a laser, with a pattern mask and moving module that control the area of laser irradiation to form metal patterns without damaging the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser irradiation is applied to pattern metal layer with non-uniform thickness, then metal patterns can be formed, but substrate damage occurs
Solution Approach 1:
The patent divides the metal layer into multiple thickness zones (first thickness region and second thickness region) and applies different laser irradiation conditions to each zone. The pattern mask segments the laser beam to selectively irradiate different areas, preventing excessive energy accumulation that would damage the substrate while ensuring complete removal of metal in all regions.
Solution Approach 2:
The patent implements local quality by applying differentiated laser irradiation parameters to different spatial regions of the metal layer. The first laser beam irradiates the first thickness region with specific energy density, while the second laser beam irradiates the second thickness region with adjusted parameters, optimizing pattern formation without causing substrate damage in each local area.
2Productivity
If laser energy is increased to remove metal layer completely, then patterning efficiency improves, but substrate damage risk increases
Solution Approach 1:
The patent changes laser irradiation parameters (energy density, irradiation time, beam focus) based on the local metal layer thickness. By dynamically adjusting these parameters for different thickness regions, the system achieves complete metal removal efficiency while maintaining substrate integrity, resolving the contradiction between productivity and damage prevention.
Solution Approach 2:
The patent introduces dynamic control of laser irradiation parameters during the patterning process. The system adaptively modifies laser energy delivery based on real-time feedback about metal layer thickness variations, enabling efficient pattern formation without exceeding substrate damage thresholds.
3Manufacturing precision
If pattern mask is used to control laser area, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The patent introduces a pattern mask as an intermediary component between the laser source and the metal layer. This mask selectively transmits or blocks laser beams to define precise pattern boundaries, achieving high manufacturing precision. The mask acts as a simple yet effective mediator that controls laser area without requiring complex real-time control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively forms metal patterns on display devices without causing damage to the substrate, ensuring reliable manufacturing processes for display devices with improved user experience.
Implementation Method 1
a light source emitting the laser
Implementation Method 2
The plurality of pad electrodes and the plurality of bump electrodes are electrically connected through the plurality of metal patterns
Implementation Method 3
an optical lens between the substrate and the pattern mask
Implementation Method 4
irradiating the metal layer with a laser to form a plurality of metal patterns
Data Source
AI summary
A laser irradiation device includes an optical system including a light source emitting a laser, a pattern mask including a plurality of patterns on which the laser emitted from the optical system is incident and through which the laser passes, and a moving module moving the pattern mask in a direction perpendicular to the substrate while irradiating the metal layer with the laser to control an area in which the metal layer is irradiated with the laser. The plurality of pad electrodes and the plurality of bump electrodes are electrically connected through the plurality of metal patterns.