Laser Cutting of Thick Materials With Layered Ablation Paths
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Solution Overview
Problem
Existing laser cutting methods for thick materials face inefficiencies in processing depth and precision, leading to thermal damage and reduced processing efficiency as the depth increases.
Innovation Solution
The method involves using a focused laser beam to move along a preset path in a triangular or fan-shaped pattern, adjusting the beam's direction to maintain an optimal angle with the material surface, and layering two-dimensional patterns to achieve the desired three-dimensional shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the laser output power is increased to maintain energy density for thick material cutting, then the processing efficiency is improved, but the heat influence area increases causing thermal damage to the material edges
Solution Approach 1:
The patent divides the thick material into multiple layers and processes each layer separately using multiple ablation passes. The laser beam processes the material in stages (first pass, second pass, etc.) rather than attempting to cut through the entire thickness in a single pass, thereby reducing thermal accumulation and edge damage while maintaining efficient processing.
2Length of moving object
If the effective focal depth of the laser beam is increased to ablate thicker material in one pass, then the processing depth is improved, but the diameter of the focal spot increases causing decreased energy density
Solution Approach 1:
The patent segments the ablation process into multiple passes, with each pass removing a controlled depth (e.g., 0.1-0.5mm per pass). This allows the use of a focused beam with optimal spot diameter and energy density for each individual pass, rather than requiring a single pass through the entire thickness with reduced energy density.
Solution Approach 2:
The laser beam performs periodic ablation passes at intervals, allowing cooling and material removal between passes. The beam returns to process the same or adjacent areas in subsequent passes, achieving progressive depth penetration while maintaining high energy density in each periodic action.
3Ease of operation
If the focused laser beam is directed vertically to the material surface, then the processing simplicity is improved, but the cut surface forms a positive taper reducing geometric precision
Solution Approach 1:
The patent introduces asymmetric processing by tilting the laser beam at specific angles (e.g., 10-30 degrees) relative to the material surface normal during certain passes. This asymmetric incidence angle compensates for the positive taper formed by vertical incidence, allowing the formation of vertical or inverted taper cut surfaces through controlled asymmetric ablation.
4Manufacturing precision
If the focused laser beam is inclined to the material surface to reduce taper, then the manufacturing precision is improved, but the material shields the laser path causing rapid power reduction at depth
Solution Approach 1:
The patent combines segmented depth processing with periodic repositioning. Instead of using a single large inclination angle that would cause severe shielding, the beam makes multiple small-angle or vertical passes at different positions and depths, progressively removing material while minimizing shielding effects in each individual pass.
Solution Approach 2:
The patent dynamically adjusts the beam inclination angle and processing parameters based on the current processing depth and material geometry. The inclination angle is not fixed but varies during the process, being more aggressive at shallower depths and more conservative at greater depths, optimizing both precision and power delivery throughout the ablation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances processing efficiency by allowing a higher moving speed of the laser beam and reducing thermal damage, while maintaining high precision and enabling the cutting of thick materials with improved back taper angles and vertical side walls.
Implementation Method 1
the material is subjected to a photo-thermoelectric effect in a spatial range in which the energy density of the beam is higher than the damage threshold value of the material
Implementation Method 2
Gasification evaporation, electron avalanche and so on) to ablate and remove the material
Implementation Method 3
The ablation of materials of particular shapes, shapes and specifications is then accomplished (also commonly referred to as 'cutting') by the movement of the light beam relative to the material
Data Source
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AI summary
A method for a laser to cut a material, comprising : driving a material (200) to move along preset paths (310); and a focused laser beam (11, 12, 14, 16) repeatedly moving on the surface of the material (200) to ablate the material (200), thereby forming a two-dimensional pattern (320) oriented to the machining depth such that, as the material (200) moves along the preset paths (310), a plurality of two-dimensional patterns (320) are generated, the two-dimensional patterns (320) being superposed to form a required form. The focused laser beam (11, 12, 14, 16) repeatedly moves along a straight line on the surface of the material (200), or repeatedly moves along the patterns (320). The method remarkably improves the machining efficiency of lasers ablating the materials, and focused laser spots may have higher speeds of movement along machining trajectories, thus improving the machining efficiency.