Laser Dicing Sequence for Strip Alignment in Chip Separation
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Solution Overview
Problem
The existing laser processing methods for dividing workpieces into chips along projected dicing lines often result in strips shifting position, leading to misalignment of second dicing lines and potential damage to devices on the workpiece, especially when the strip width is 0.5 mm or less.
Innovation Solution
A method involving a laser beam processing technique that first divides the workpiece into strips along one set of dicing lines and then into chips along a perpendicular set, using a cycle of laser applications to maintain alignment and minimize device damage, optionally with a tape affixing step and laser-processed groove forming to stabilize the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the workpiece is divided into strips along the first projected dicing lines, then the workpiece can be segmented into manageable sections, but the strips may shift in position along the first direction causing misalignment
Solution Approach 1:
The patent applies preliminary action by performing the first dicing process to divide the workpiece into strips before performing the second dicing process. The strips are divided along the first projected dicing lines in advance, creating intermediate sections that are then further divided. This sequential approach allows for controlled segmentation while maintaining alignment through the established dicing line grid system.
Solution Approach 2:
The patent applies segmentation by dividing the workpiece into strips along the first projected dicing lines, and then dividing those strips into individual chips along the second projected dicing lines. This two-stage segmentation process breaks down the complex task of dividing the entire workpiece into manageable sections, improving processing efficiency while maintaining precision through the structured dicing line framework.
2Productivity
If the strips are divided from the workpiece, then the workpiece can be processed in sections, but the second projected dicing lines do not line up potentially damaging the devices
Solution Approach 1:
The patent applies feedback by using the established grid of projected dicing lines as a reference framework throughout the dicing process. The first and second projected dicing lines form an interconnected grid that provides continuous positional reference, allowing the system to maintain alignment feedback during the sequential dicing operations and prevent laser beam misalignment that could damage devices.
Solution Approach 2:
The patent establishes the grid of projected dicing lines in advance before performing the dicing operations. Both the first and second sets of projected dicing lines are pre-defined to form a grid pattern, creating a preliminary alignment framework that guides the sequential dicing process and ensures that subsequent laser processing remains aligned with the intended chip boundaries.
3Quantity of substance
If the width of the strips is reduced to 0.5 mm or less, then more chips can be produced from the workpiece, but the strips tend to shift in position more frequently
Solution Approach 1:
The patent applies segmentation by implementing a two-stage dicing process where the workpiece is first divided into strips along the first projected dicing lines, and then those strips are divided into individual chips along the second projected dicing lines. This segmentation approach allows for the production of numerous small chips (0.5 mm or less width) while maintaining position stability through the structured grid framework that guides both dicing stages.
Solution Approach 2:
The patent establishes the complete grid of projected dicing lines (both first and second sets) in advance before performing the dicing operations. This preliminary action creates a stable reference framework that remains valid throughout the process, allowing strips of reduced width (0.5 mm or less) to be produced with maintained position stability, as the pre-established grid provides continuous positional reference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively minimizes damage to devices on the workpiece by ensuring precise alignment and consistent strip positioning, allowing for accurate division into chips without damaging the devices during the laser processing.
Implementation Method 1
applying a laser beam to the workpiece along the first projected dicing lines to divide the workpiece into a plurality of strips
Implementation Method 2
applying the laser beam to the workpiece along the second projected dicing lines to divide the workpiece into a plurality of chips
Data Source
AI summary
A method of processing a workpiece includes a first processing step of applying the laser beam to the workpiece along a plurality of first projected dicing lines to divide the workpiece into a plurality of strips, and after the first processing step, a second processing step of applying the laser beam to the workpiece along a plurality of second projected dicing lines to divide the workpiece into a plurality of chips. The first processing step includes applying the laser beam along each of the first projected dicing lines from one end to another end thereof. The second processing step includes repeating a cycle of applying the laser beam along one of the second projected dicing lines from one end to another end thereof and thereafter applying the laser beam along a next one of the second projected dicing lines from the other end to the one end thereof.