Enclosure Air Plenum for Cooling Electronic Circuitry
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Solution Overview
Problem
Current cooling systems for rack-mounted equipment housings face issues such as overheating due to blocked air intakes, high acoustic noise from fans, and aesthetic concerns due to fan visibility, as well as inefficiencies in heat dissipation and fan placement.
Innovation Solution
The proposed solution involves an enclosure with strategically placed air intake and exhaust holes, an air plenum piece that divides the enclosure into volumes for air circulation, and a heat sink with a cooling fan, which directs cooling air over the heat sink to remove heat effectively while minimizing noise and visibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the fan is placed right above the high wattage device to cool it effectively, then the cooling efficiency is improved, but the acoustic noise increases significantly
Solution Approach 1:
The housing is divided into multiple compartments using partitions that separate the fan from the high wattage device. The fan is placed in a separate compartment, allowing it to cool the device indirectly through air circulation rather than direct placement above it, thus reducing acoustic noise while maintaining cooling effectiveness.
Solution Approach 2:
Air circulation paths are created as intermediaries between the fan and the high wattage device. The fan moves air through defined pathways that indirecty cool the device without requiring the fan to be positioned directly above it, thereby reducing noise while maintaining cooling efficiency.
2Temperature
If the vent holes are placed right above the fan for effective cooling, then the cooling performance is improved, but the aesthetic appearance deteriorates due to visible fans and vents
Solution Approach 1:
The housing interior is segmented into separate zones using partitions, allowing the fan to be concealed in one compartment while vent holes are strategically placed in other compartments. This segmentation enables the fan to remain hidden from external view while still performing its cooling function effectively.
Solution Approach 2:
The fan is nested within a compartment that is itself contained within the larger housing structure. The fan compartment is integrated into the overall housing design, allowing the fan to be hidden while still accessing the high wattage device for cooling purposes.
3Temperature
If the fan is positioned to cool the high wattage device directly, then the cooling effectiveness is improved, but the device complexity increases due to additional mounting requirements
Solution Approach 1:
The partitions and compartments serve multiple functions: they provide structural support for the housing, create acoustic barriers to reduce noise, define air circulation pathways for cooling, and provide mounting surfaces for the fan and high wattage device. This multi-functionality reduces the need for additional specialized mounting structures.
Solution Approach 2:
The fan mounting structure is merged with the housing partitions and compartments rather than requiring separate independent mounting systems. The partitions themselves serve as mounting structures for both the fan and the high wattage device, simplifying the overall mounting requirements by combining multiple functions into single structural elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency by preventing overheating, reduces acoustic noise, and maintains a clean aesthetic by positioning the fan away from air intakes, allowing for effective heat dissipation without obstructing other housing functions.
Implementation Method 1
a fan located in coaxial alignment with the air plenum hole, the heat sink and the electronic circuitry each being located in the second volume, whereby when the fan operates, cooling air is drawn from an exterior of the enclosure through the plurality of air intake holes into the first volume, then through the air plenum hole into the second volume, then over the heat sink to remove heat away from the heat sink
Implementation Method 2
then over the heat sink to remove heat away from the heat sink
Implementation Method 3
cooling air is drawn from an exterior of the enclosure through the plurality of air intake holes into the first volume, then through the air plenum hole into the second volume, then over the heat sink to remove heat away from the heat sink
Data Source
AI summary
An apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are in an upper portion of a first panel that faces a first direction. Air exhaust holes are in an upper portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.