Encrypted Thermal R-Network for IC Package Analysis
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Solution Overview
Problem
Thermal analysis of integrated circuit packages is hindered when multiple companies are involved, as sensitive information about component structures and material properties must be shared, leading to inaccurate results due to missing key data.
Innovation Solution
A method where the detailed information of secured components is encrypted, allowing only a thermal resistance-network and node location file to be shared, which is decrypted by a thermal model generator to generate a thermal R-network, enabling accurate thermal analysis without revealing proprietary details.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If detailed component information is shared for thermal analysis, then measurement precision is improved, but loss of information increases due to proprietary data exposure
Solution Approach 1:
The patent extracts only the essential thermal parameters (thermal conductivity, specific heat capacity, density) from the complete component information, separating these necessary data points from proprietary details such as manufacturing processes, material compositions, and design specifications. This extraction allows thermal analysis to proceed with sufficient accuracy while minimizing information exposure.
Solution Approach 2:
The patent introduces an intermediary data format that acts as a mediator between the component manufacturer and the thermal analysis tool. This intermediary format contains only the thermal properties needed for analysis, preventing direct exposure of sensitive information while still enabling accurate thermal modeling and simulation.
2Reliability
If complete component information is collected for thermal analysis, then reliability is improved, but device complexity increases due to cross-company information exchange
Solution Approach 1:
The patent extracts only the essential thermal parameters (thermal conductivity, specific heat capacity, density) from the complete component information, separating these necessary data points from proprietary details such as manufacturing processes, material compositions, and design specifications. This extraction allows thermal analysis to proceed with sufficient accuracy while minimizing information exposure.
Solution Approach 2:
The patent creates a universal data exchange format that can be used across different companies and tools. This standardized format enables multiple parties to exchange thermal information without requiring complex custom integration, reducing the overall system complexity while maintaining analysis reliability.
3Ease of operation
If assumed structures and material properties are used, then ease of operation is improved, but measurement precision deteriorates due to significant deviation from actual results
Solution Approach 1:
The patent introduces an intermediary data format that acts as a mediator between the component manufacturer and the thermal analysis tool. This intermediary format contains only the thermal properties needed for analysis, preventing direct exposure of sensitive information while still enabling accurate thermal modeling and simulation.
Solution Approach 2:
The patent changes the parameters being exchanged from complete component specifications to only the essential thermal properties (thermal conductivity, specific heat capacity, density). This parameter reduction maintains measurement precision by focusing on the critical factors that actually affect thermal behavior, while simplifying the information exchange process.
Data Source
AI summary
A method includes retrieving a first component information of a secured portion of a package, wherein the first component information is encrypted. The step of retrieving includes decrypting the first component information. A thermal resistance-network (R-network) is generated from the decrypted first component information. A temperature map of the package is generated using the thermal R-network and a second component information of an unsecured portion of the package, wherein the secured portion and the unsecured portion are bonded to each other.