End Effector Clamping Slab Substrates Without Deformation
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Solution Overview
Problem
Existing end effectors for clamping substrates often deform thin substrates, occupy a significant surface area, and are not suitable for gripping at narrow rim sections, especially in clean environments like semiconductor manufacturing, where they can contaminate the environment and are inefficient.
Innovation Solution
An end effector with a guide that adjusts the movement of a pressing device relative to a support device, allowing for clamping of substrates with varying thickness and deformation, using an elastic guide to exert a controlled pressing force without deforming the substrate, and incorporating a vacuum cylinder for safe operation in clean environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum cups are used to grip the substrate, then the substrate can be held, but a great part of the substrate surface is occupied and thin substrates are deformed
Solution Approach 1:
The end effector is divided into a pressing device with pressing area and a support device with support area, acting at opposite sides of the substrate. This segmentation allows gripping without occupying large surface area on one side, resolving the contradiction between reliable holding and minimal surface occupation.
Solution Approach 2:
The support device extends through the substrate from the opposite side, utilizing the third dimension (thickness direction) to provide support. This dimensional approach allows the end effector to hold the substrate without occupying excessive surface area on the treatment side.
2Reliability
If vacuum cups are used to grip the substrate, then the substrate can be held, but thin substrates are deformed by forces in the suction area
Solution Approach 1:
By separating the pressing function and support function into two independent devices acting at opposite sides, the pressing force is distributed and balanced, preventing localized deformation of thin substrates while maintaining reliable holding capability.
Solution Approach 2:
The end effector changes the pressure distribution parameters by applying pressure from both sides of the substrate simultaneously, transforming the force application mode from unidirectional suction to bidirectional pressing, thereby eliminating substrate deformation.
3Reliability
If mechanical grippers with shape memory alloy are used, then the substrate can be clamped, but the reaction is slow and heat is generated consuming much energy
Solution Approach 1:
The patent replaces complex mechanical systems (shape memory alloys) with a simpler mechanical linkage system consisting of a guide, pressing device, and support device. This substitution reduces energy consumption and eliminates heat generation while maintaining reliable clamping capability.
4Reliability
If mechanical elements with interlocking are used, then the substrate can be gripped, but particles are generated contaminating the clean environment
Solution Approach 1:
The patent replaces interlocking mechanical elements with a pressing-support mechanism that uses distributed pressure forces. This substitution eliminates particle-generating mechanical interactions while maintaining reliable substrate gripping capability in clean environments.
Solution Approach 2:
The end effector utilizes pneumatic or hydraulic pressure distribution through the pressing and support devices, replacing mechanical interlocking with fluid pressure-based gripping. This approach eliminates particle generation from mechanical contact while maintaining secure substrate holding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The end effector effectively clamps substrates without significant deformation, occupies minimal surface area, and maintains cleanliness, enabling efficient handling of substrates in both clean and chemically aggressive environments.
Implementation Method 1
the guide is arranged to guide the pressing device relative to the support device such that the end effector is movable relative to the substrate during a process of clamping the substrate by the end effector
Implementation Method 2
incorporating a vacuum cylinder for safe operation in clean environments
Data Source
AI summary
An end effector for clamping a slab formed substrate (2) having a rim section (5) that is arranged at least approximately and at least partially in a substrate main plane comprises at least a pressing device (10) providing at least a pressing area (11), and at least a support device (20) providing at least a support area (21). The end effector (1) is configured, in a clamped state of the substrate (2), to clamp the substrate (2) at a first surface (3) by a pressing area (11) of a pressing device (10) and at a second surface (4) that is, in regard to the first surface (3), arranged at the opposite side of the substrate (2) by a support area (21) of a support device (20). The end effector comprises a guide (15) for guiding the pressing device (10) relative to the support device (20).