Endoscope Image Pickup Module With Thermal-Isolating Wiring Board
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Solution Overview
Problem
Existing image pickup apparatuses face challenges in achieving a compact design while maintaining high-quality image capture, as heat generated by stacked semiconductor devices can interfere with the image pickup device, leading to reduced image quality due to heat transfer issues.
Innovation Solution
The design incorporates a wiring board with a central section acting as a heat insulation member, separating the image pickup device from the stacked device, and utilizing signal cables to dissipate heat generated by the stacked device, thereby preventing heat transfer to the image pickup device. This is achieved through a rigid-flexible wiring board structure with specific thermal resistance properties and resin materials that minimize heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the stacked device is bonded directly to the rear surface of the image pickup device, then the length in the optical axis direction is reduced, but heat transfer from the stacked device to the image pickup device occurs, degrading image quality
Solution Approach 1:
A wiring board is introduced as an intermediary component between the image pickup device and the stacked device. The wiring board includes a heat insulation section with thermal resistance that blocks heat transfer from the stacked device to the image pickup device, while still allowing electrical connections through conductors. This mediator resolves the contradiction by enabling direct bonding (shortening length) while preventing harmful heat transfer.
Solution Approach 2:
The wiring board is designed with different thermal properties in different regions: a heat insulation section with high thermal resistance to block heat flow toward the image pickup device, and conductor sections with good electrical conductivity for signal transmission. This local differentiation of thermal quality allows the structure to simultaneously achieve compactness and heat isolation.
2Object-affected harmful factors
If a heat insulation structure is introduced between the image pickup device and stacked device, then heat transfer is prevented, but the length in the optical axis direction increases
Solution Approach 1:
The wiring board serves multiple functions simultaneously: it provides electrical connections between the image pickup device and stacked device, acts as a heat insulation barrier, and provides mechanical support. By making the wiring board multi-functional, the need for separate heat insulation components is eliminated, preventing length increase while maintaining heat isolation.
Solution Approach 2:
The wiring board acts as a mediator that combines heat insulation functionality with electrical connection functionality in a single component. This eliminates the need for additional heat insulation layers that would increase the overall length, as the wiring board itself performs both roles.
3Adaptability or versatility
If multiple semiconductor devices are stacked to increase functionality, then device capabilities are enhanced, but heat generation increases, affecting image pickup quality
Solution Approach 1:
The wiring board with its heat insulation section acts as a mediator that allows the stacked device configuration (enhancing functionality) while blocking the harmful thermal effects from reaching the image pickup device. This enables high-functionality multi-device stacking without compromising image quality.
Solution Approach 2:
The wiring board is segmented into different functional regions: heat insulation sections with high thermal resistance to block heat flow, and conductor sections for electrical connections. This segmentation allows the system to accommodate multiple heat-generating semiconductor devices while protecting the temperature-sensitive image pickup device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact image pickup apparatus with a short length in the optical axis direction, effectively preventing heat transfer from the stacked device to the image pickup device, ensuring high-quality image capture and maintaining the reliability of semiconductor circuits.
Implementation Method 1
a heat insulation section, with a larger thermal resistance than a conventional image pickup apparatus, between the stacked device and the image pickup device
Implementation Method 2
the intermediate section is bent into a state that covers a side surface of the stacked device, and the intermediate section is secured
Data Source
AI summary
An image pickup apparatus includes an image pickup member including an image pickup device, a stacked device in which a plurality of semiconductor devices are stacked, a wiring board having a first principal surface and a second principal surface, the wiring board including a central section having a substrate thicker than the image pickup device, an intermediate section that is extended from the central section and is bent, and a terminal section that is extended from the intermediate section, the image pickup member being bonded to the first principal surface of the central section, the stacked device being bonded to the second principal surface of the central section, and a plurality of signal cables bonded to the terminal section.