Endoscope Image Pickup Unit Resin Filling for Compact Strength

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing image pickup units for endoscopes face challenges in downsizing and reducing diameter to achieve minimal invasion, with conventional methods requiring multiple resin arranging and curing steps, which complicates the manufacturing process and may compromise mechanical strength.

Innovation Solution

An image pickup unit design featuring a stacked optical unit with notches on its side surfaces filled with resin, where the resin also bonds the image sensor, eliminating the need for separate resin regions and curing steps, thereby enhancing mechanical strength and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a wafer-level stacked optical unit is used to downsize the image pickup unit, then the diameter is reduced, but the mechanical strength is insufficient

Engineering Contradiction:
Improvediameter of image pickup unitVSAvoidmechanical strength of optical unit
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The patent applies resin to fill notches formed on the side surfaces of the optical unit before bonding the image sensor to the optical unit. This preliminary filling of notches with resin reinforces the optical unit's structure prior to the bonding process, preventing breakage during subsequent handling and assembly operations.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If resin is applied to bond the image sensor and fill notches in separate steps, then the manufacturing process becomes complex, but using a single resin application improves productivity

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidnumber of resin application steps
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent combines the resin application for filling notches and the resin application for bonding the image sensor into a single resin application step. The resin is applied to simultaneously perform both functions: filling the notches on the side surfaces and creating the bonding layer between the image sensor and optical unit. This eliminates the need for separate resin application and curing steps, thereby improving manufacturing productivity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The resin material serves multiple functions simultaneously: it fills the notches to provide mechanical reinforcement, acts as an adhesive to bond the image sensor to the optical unit, and provides structural support. This multi-functionality of the resin eliminates the need for separate materials and processing steps for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution allows for efficient production of a compact image pickup unit with improved mechanical strength, reducing the risk of damage and increasing productivity by integrating resin functions for bonding and sealing in a single step.

Implementation Method 1

resin which includes a first region between the light-receiving surface and the exit surface, the first region bonding the optical unit and the image sensor to each other, and a second region filling the notch of the optical unit

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

the first region bonding the optical unit and the image sensor to each other

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20240334035A1Image pickup unit, endoscope, and method for manufacturing image pickup unit
Publication Date: 2024.10.03 OLYMPUS MEDICAL SYST CORP
  • US20240334035A1 patent drawing
  • US20240334035A1 patent drawing
  • US20240334035A1 patent drawing

AI summary

An image pickup unit includes: an optical unit which includes a plurality of stacked optical elements and in which at least corners of four side surfaces have a notch being notched from an exit surface toward an incidence surface; an image sensor including a light-receiving surface; and resin which includes a first region between the light-receiving surface and the exit surface, the first region bonding the optical unit and the image sensor to each other, and a second region filling the notch of the optical unit, and which does not include an interface between the first region and the second region.