Endoscope Image Sensor Package Layout for Uniform Illumination
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Solution Overview
Problem
Conventional endoscopes are bulky, have low light utilization efficiency, and suffer from non-uniform illumination and shadows due to the placement of image sensors and light emitting elements, which are not optimally aligned, leading to complications in fabrication and larger size.
Innovation Solution
The image sensor package is manufactured by forming trenches and dicing lines on a substrate to define substrate units, aligning the image sensor and light emitting elements for optimal illumination, and encapsulating them with a high-transmittance material while maintaining electrical connections, allowing for miniaturization and efficient space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional flexible circuit board structure with soldered cables is used, then electrical connections can be established, but the endoscope structure becomes complicated and size increases
Solution Approach 1:
The patent integrates the image sensor, light emitting elements, and flexible circuit board into a single unified package structure. The substrate serves as both the mounting platform for electronic components and the flexible circuit carrier, eliminating the need for separate cable assemblies and reducing overall structural complexity while minimizing endoscope size
Solution Approach 2:
The flexible circuit board substrate performs multiple functions simultaneously: it provides mechanical support for the image sensor and light emitting elements, serves as the circuit carrier for electrical connections, and acts as the structural framework for the entire endoscope package. This multi-functionality reduces the number of separate components needed
2Illumination intensity
If light emitting elements are disposed on conventional structures, then electrical connections are possible, but light output surfaces cannot face upwards and uniform illumination is difficult to achieve
Solution Approach 1:
The patent positions light emitting elements at specific locations around the image sensor with their light output surfaces facing upward toward the distal end opening. This localized arrangement ensures that illumination is directed precisely where needed, achieving uniform lighting across the imaging area while maintaining a simple overall structure
Solution Approach 2:
The patent transitions from planar arrangement of components to a three-dimensional configuration where light emitting elements are positioned around the image sensor in multiple directions. This spatial arrangement allows light to be emitted upward and from multiple angles, achieving uniform illumination without increasing structural complexity
3Volume of moving object
If conventional injection-molding encapsulation is used, then elements are protected and fixed, but distal-end space utilization is inefficient and positioning is difficult
Solution Approach 1:
The patent divides the package substrate into multiple regions using trenches, creating distinct functional zones for the image sensor, light emitting elements, and electrical connections. This segmentation allows for efficient use of the distal-end space while providing clear positioning guides that simplify assembly operations
Solution Approach 2:
The package substrate is pre-formed with integrated circuit patterns, trench divisions, and mounting positions before components are assembled. This preliminary preparation of the substrate structure enables efficient space utilization and facilitates easy positioning and assembly of the image sensor and light emitting elements without requiring complex post-assembly adjustments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a miniaturized endoscope with improved illumination uniformity, reduced shadows, and enhanced imaging quality, facilitating easier assembly and mass production.
Implementation Method 1
disposing at least one light emitting element on the second surface of the package substrate and electrically connecting the light emitting element with the third conductive contacts
Implementation Method 2
disposing an image sensor on the second surface of the package substrate and electrically connecting the image sensor with the plurality of second conductive contacts
Data Source
AI summary
A method for manufacturing an image sensor package is provided, in which a plurality of trenches is provided in the package substrate and the trenches and a plurality of predetermined dicing lines define the desired contour of the package substrate to maximize the space utilization of the image sensor package in the distal end of the endoscope. In addition, the contour of the package substrate matches the shape of the distal end of the endoscope, thus facilitating the positioning and assembly of the image sensor package. An image sensor package manufactured by the abovementioned manufacturing method and an endoscope including the image sensor package are also disclosed.