Epoxy Resin Composition Adhesion to Metallic Materials
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Solution Overview
Problem
Epoxy resin compositions used for encapsulating semiconductor devices, particularly power devices, face challenges with adhesion to metallic materials like nickel and aluminum, leading to detachment and reduced heat conductivity, which affects the reliability of the devices.
Innovation Solution
An epoxy resin composition incorporating a carboxylic acid compound like gallic acid, along with an epoxy resin, curing agent, curing accelerator, and inorganic filler, which enhances adhesion to metallic materials by chemical bonding with metal surfaces, and optionally includes a silicone compound to improve adhesion and reduce water absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional epoxy resin compositions are used for encapsulating power devices, then the encapsulation provides good heat resistance, but the adhesion to metallic materials (nickel, aluminum) is poor, leading to detachment
Solution Approach 1:
The patent introduces a silane coupling agent as an intermediary substance between the epoxy resin composition and the metallic material surface. This coupling agent contains both organofunctional groups that bond with the resin and inorganic groups that bond with the metal oxide layer on the metal surface, thereby mediating the adhesion interface and solving the poor adhesion problem
Solution Approach 2:
The patent creates a composite adhesion system by combining epoxy resin with silane coupling agents. The silane-modified epoxy resin forms a composite material that exhibits both the thermal resistance of epoxy and enhanced adhesion properties through the silane groups that interact with metal surfaces
2Ease of manufacture
If detachment occurs between encapsulating resin and metallic material, then the device can be manufactured, but heat conductivity in the encapsulating resin decreases
Solution Approach 1:
The silane coupling agent acts as an intermediary that ensures continuous thermal pathways between the metal substrate and the epoxy encapsulant. By preventing detachment and creating strong interfacial bonding, it maintains the thermal conductivity network that would otherwise be disrupted by delamination
Solution Approach 2:
The patent modifies the chemical and physical parameters of the epoxy resin system by incorporating silane coupling agents. This changes the interfacial properties and thermal transport characteristics, transforming the system from one prone to detachment and thermal degradation to one with stable thermal conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent adhesion to metallic materials, suppressing detachment and improving the reliability of electronic component devices by ensuring strong bonding and controlled water absorption, thereby enhancing the thermal conductivity and durability of the encapsulated components.
Implementation Method 1
having at least one carboxy group and at least one hydroxy group... the carboxylic acid compound comprises gallic acid... enhances adhesion to metallic materials by chemical bonding with metal surfaces
Implementation Method 2
an epoxy resin, a curing agent... the cured product of the epoxy resin composition encapsulating the electronic component
Data Source
AI summary
An epoxy resin composition, comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a carboxylic acid compound that satisfies at least one selected from the group consisting of the following A, B and C below: A: having at least one carboxy group and at least one hydroxy group; B: having at least two carboxy groups; and C: having a structure in which two carboxy groups are condensed by dehydration.