Epoxy-Oxetane Compound Resolving Curing Speed and Heat Resistance
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Solution Overview
Problem
Current resin compositions using oxetane compounds lack a curable compound with high curing speed and excellent heat resistance and dimensional stability, which are essential for advanced applications in coatings, adhesives, and electronic materials.
Innovation Solution
A novel epoxy-oxetane compound is synthesized by connecting two epoxycyclohexyl groups to an oxetane ring via a spacer, allowing for efficient crosslinking and curing, and a method involving the reaction of an oxetane compound with an olefin compound followed by epoxidation to achieve this structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional oxetane compounds are used in resin compositions, then the resin exhibits good toughness and mechanical properties, but the curing speed is insufficient and heat resistance is inadequate
Solution Approach 1:
The patent employs a composite molecular structure combining epoxycyclohexyl groups with an oxetane ring through a spacer. This composite structure integrates the high reactivity of epoxy groups (improving curing speed) with the thermal stability of cyclohexane rings (improving heat resistance), while maintaining the mechanical properties associated with oxetane-based resins. The synergistic combination of different functional groups within a single molecule resolves the contradiction between curing speed and heat resistance.
2Ease of manufacture
If the molecular structure is simplified for easier synthesis, then manufacturing becomes easier, but the curability and crosslinking efficiency are reduced
Solution Approach 1:
The molecular structure is segmented into distinct functional modules: epoxycyclohexyl groups providing reactivity, a spacer providing flexibility and spacing, and an oxetane ring providing structural integrity. This segmentation allows each component to be optimized independently for its specific function while maintaining overall synthesis feasibility through established chemical pathways for forming each segment and their connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting resin composition exhibits rapid curing, superior heat resistance, and improved brittleness, outperforming conventional resin compositions in terms of curability and thermal stability.
Implementation Method 1
reacting an oxetane compound represented by the chemical formula (III) and an olefin compound represented by the chemical formula (IV) to generate an olefin-oxetane compound represented by the chemical formula (Ia)
Implementation Method 2
epoxidizing the double bond
Data Source
Figure 1
AI summary
The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I'), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.