Multi-Layered Epoxy Polyimide Coating for Light Shielding
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Solution Overview
Problem
Electronic components, particularly those used in medical devices, are sensitive to light and thermal variations, leading to performance issues and latent failures due to exposure to varying light intensities and thermal/mechanical shocks during assembly and use.
Innovation Solution
A multi-layered protective coating comprising a first cured epoxy layer, a polyimide film, and a second cured epoxy layer is applied to electronic components, providing protection against adverse effects from light, thermal, and mechanical shocks. The coating is formed by depositing and curing epoxy resins, with the polyimide film interposed between the epoxy layers, and is designed to encapsulate the components and electrical connection members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are exposed to varying light intensities and thermal variations during assembly and use, then the components can be manufactured and deployed in diverse environments, but the performance and reliability of these components deteriorate due to light sensitivity and thermal shock
Solution Approach 1:
The patent applies composite materials by creating a multi-layer protective coating system comprising a first epoxy layer, a polyimide film layer, and a second epoxy layer. Each layer serves specific protective functions: the epoxy layers provide mechanical protection and adhesion, while the polyimide layer provides thermal stability and light blocking. This composite structure resolves the contradiction by enabling components to withstand varying environmental conditions (light intensity and temperature) without performance degradation, thus maintaining reliability across diverse environments.
2Reliability
If a protective coating is applied to shield electronic components from light and thermal shock, then the reliability of components improves, but the device complexity and manufacturing process become more complex
Solution Approach 1:
The protective coating is segmented into three distinct layers with specific functions: the first epoxy layer provides initial protection and adhesion to the component, the polyimide film layer provides thermal stability and light blocking, and the second epoxy layer provides final sealing and mechanical protection. This segmentation allows each layer to be optimized for its specific function while collectively providing comprehensive protection, resolving the contradiction between reliability improvement and device complexity.
Solution Approach 2:
The patent utilizes parameter changes by selecting materials with specific properties: the polyimide layer has a glass transition temperature above 200°C to withstand thermal shock, while the epoxy layers are formulated for optimal adhesion and mechanical strength. The curing process parameters (temperature, time, UV exposure) are also controlled to achieve the desired protective properties. These parameter optimizations enable effective protection without unnecessarily increasing complexity.
3Object-affected harmful factors
If a multi-layer protective coating is applied to protect electronic components, then protection against light, thermal, and mechanical shocks is achieved, but the manufacturing time and process complexity increase
Solution Approach 1:
The protective coating layers are applied in a predetermined sequence during the component assembly process: the first epoxy layer is applied and cured, followed by the polyimide film placement, and finally the second epoxy layer application and curing. This preliminary action approach integrates the protective coating process into the existing manufacturing workflow, allowing protection to be established before the component is fully assembled and deployed, thus minimizing additional manufacturing time while achieving comprehensive protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layered coating effectively shields electronic components from light, thermal, and mechanical stresses, enhancing their reliability and durability by minimizing performance degradation and preventing latent failures caused by environmental and assembly-related issues.
Implementation Method 1
the first epoxy resin comprises applying ultraviolet (UV) light to the first epoxy resin
Implementation Method 2
curing the second epoxy resin comprises applying ultraviolet (UV) light to the second epoxy resin
Data Source
AI summary
Various embodiments are directed to a method for protecting an electronic comprising: depositing a first epoxy resin on the electronic component; curing the first epoxy resin to form a first cured epoxy layer, disposing a polyimide film on the first cured epoxy layer to form a polyimide layer, depositing a second epoxy resin on the polyimide layer, and curing the second epoxy resin to form a second cured epoxy layer. The first cured epoxy layer, the polyimide layer, and the second epoxy layer form a multi-layered protective coating that is configured at least in part to protect the electronic component from at least adverse effects from varying light intensities.