Epoxy Resin Composition for LED Packages

The patent uses a composite epoxy resin system combining triazine derivative epoxy compound with other epoxy compounds (such as phenolic epoxy, cresolic epoxy, or biphenolic epoxy) to achieve both semi-solid formation and improved reliability. The composite resin system leverages the advantages of each component: triazine derivative provides semi-solid structure while other epoxy compounds enhance light, heat and moisture resistance.

The patent modifies the chemical composition parameters of the epoxy resin system by incorporating specific compounds with proven resistance to yellowing and improved silicon adhesion. The resin composition is designed with controlled molecular structures that maintain structural strength while resisting degradation from UV exposure and thermal stress, thereby preventing yellowing and enhancing adhesion to silicon substrates.

The patent employs preliminary action by using a curing agent system that ensures complete or near-complete reaction of epoxy groups before the product is put into service. The curing formulation and processing conditions are optimized to achieve full crosslinking, eliminating unreacted epoxy that would otherwise cause yellowing and light transmittance degradation over time, while still maintaining appropriate flexibility through the network structure design.

The patent incorporates inorganic fillers such as TiO2 (titanium dioxide) or SiO2 (silicon dioxide) into the epoxy resin composition to enhance optical properties. These fillers increase the refractive index and reflectivity of the encapsulant, improving light extraction efficiency and maintaining high light transmittance. The composite material system achieves both reliable encapsulation and superior optical performance.