Epoxy Resin Surface Modifying Layer for Resist Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for forming resist patterns on substrates, such as silicon wafers, face challenges in achieving excellent adhesion, resistance to pattern collapse, and high resolution, especially when using surface modifying layers formed with epoxy resins of relatively high molecular weight, which can lead to inadequate bonding and detachment issues during etching treatments.
Innovation Solution
A surface modifying material containing an epoxy resin with a weight average molecular weight of 1,000 to 50,000 is applied between the substrate and the resist film, enhancing adhesion and preventing pattern collapse by forming a uniform crosslinking layer that improves the bonding between the resist pattern and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a surface modifying layer is formed using an epoxy resin of relatively high molecular weight, then the adhesion between the substrate and resist film is improved, but the in-plane uniformity deteriorates and detachment occurs during etching treatments
Solution Approach 1:
The patent applies parameter changes by controlling the molecular weight of the epoxy resin within a specific range (1,000 to 50,000) to optimize both adhesion strength and in-plane uniformity. This parameter optimization resolves the contradiction by finding the optimal molecular weight range that provides sufficient adhesion while maintaining uniformity across the substrate surface.
2Strength
If a surface modifying layer is formed to improve adhesion, then bonding between resist pattern and substrate is enhanced, but pattern collapse resistance deteriorates
Solution Approach 1:
The patent resolves this contradiction by optimizing the molecular weight parameter of the epoxy resin to fall within 1,000 to 50,000. This specific parameter range ensures that the surface modifying layer provides adequate bonding strength while maintaining the structural integrity needed to prevent pattern collapse during processing.
3Strength
If conventional epoxy resins are used for surface modification, then adhesion is improved, but resolution and adhesion uniformity deteriorate
Solution Approach 1:
The patent addresses this contradiction by implementing precise control over the epoxy resin molecular weight parameter, specifying it should be between 1,000 and 50,000. This parameter control enables the formation of a surface modifying layer that simultaneously achieves good adhesion and maintains high resolution patterning capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the specified epoxy resin-based surface modifying material ensures excellent adhesion, prevents pattern collapse, and maintains high resolution, even during etching treatments, by ensuring uniform bonding and improved in-plane uniformity of the substrate.
Implementation Method 1
forming a uniform crosslinking layer that improves the bonding between the resist pattern and the substrate
Data Source
AI summary
A surface modifying material for forming a surface modifying layer provided between a substrate and a resist film, the surface modifying material including an epoxy resin having a weight average molecular weight of 1,000 to 50,000;a method of forming a resist pattern, including: forming a surface modifying layer on a substrate using the surface modifying material, forming a resist film on the substrate, on which the surface modified layer has been formed, using a resist composition, conducting exposure of the resist film, and alkali developing the resist film to form a resist pattern; anda method of forming a pattern, including: etching the substrate, on which a resist pattern has been formed by the method of forming a resist pattern.