Integrated ESD Capacitance Layout for Common-Mode Noise Filtering

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Solution Overview

Problem

Conventional CAN physical-layer components fail to adequately filter out common-mode noise due to significant asymmetry between differential-signal components on transmission lines.

Innovation Solution

Integration of additional parallel capacitance within the ESD device by modifying the sizes of metal features in the ESD device's metal layers to increase capacitance between I/O and ground terminals, allowing improved filtering of common-mode noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional ESD device structure is used, then device simplicity and manufacturing ease are maintained, but ability to filter common-mode noise is insufficient

Engineering Contradiction:
Improvecommon-mode noise filteringVSAvoidESD device structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent combines the ESD protection function with common-mode noise filtering function into a single integrated device. The metal features that form the ESD protection circuit also create parasitic capacitance that provides common-mode noise filtering, eliminating the need for separate filtering components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent modifies the geometry parameters of metal features (size, spacing, arrangement) to optimize both ESD protection performance and common-mode noise filtering. By adjusting these parameters, the parasitic capacitance is enhanced to provide effective noise filtering while maintaining the ESD device's protective function.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If additional parallel capacitance is added to improve common-mode noise filtering, then noise filtering ability is enhanced, but device area and layout complexity increase

Engineering Contradiction:
Improvecommon-mode noise filteringVSAvoidESD device footprint
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The ESD device's own metal features, which are already present for protection functionality, serve dual purposes by generating the parasitic capacitance needed for common-mode noise filtering. The device uses its inherent structure to provide the filtering capability without requiring additional dedicated components.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The metal features in the ESD device perform multiple functions: providing ESD protection through the protection circuit and simultaneously providing common-mode noise filtering through the parasitic capacitance they generate. This multi-functionality eliminates the need for separate filtering components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhanced ability to filter out common-mode noise even with significant asymmetry between differential-signal components, while maintaining the same footprint and layout as conventional ESD devices.

Implementation Method 1

Integration of additional parallel capacitance within the ESD device by modifying the sizes of metal features in the ESD device's metal layers to increase capacitance between I/O and ground terminals

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS11848553B2Electro-static discharge device with integrated capacitance
Publication Date: 2023.12.19 NXP USA INC
  • US11848553B2 patent drawing
  • US11848553B2 patent drawing
  • US11848553B2 patent drawing

AI summary

An integrated electro-static discharge (ESD) device has a set of metal layers. Each metal layer in the set has one or more first-terminal metal features interleaved with one or more second-terminal metal features in a lateral direction, and at least one first-terminal metal feature in a metal layer of the set overlaps in a normal direction at least one second-terminal metal feature in an adjacent metal layer of the set. By overlapping metal features in the normal direction, capacitance can be added to the ESD device, which improves its operating characteristics, without increasing the layout size of the ESD device.