Etchant Composition for Copper Wire Etching Stability
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Solution Overview
Problem
Existing etchant compositions for display devices, particularly for copper wires, face challenges in maintaining stability and reliability due to issues with etching rates, straightness, and storage stability, leading to defects and reduced processing capacity.
Innovation Solution
An etchant composition comprising specific weight percentages of persulfate, sulfonic acid, phosphoric acid, fluorine compounds, 4-nitrogen cyclic compounds, 2-nitrogen cyclic compounds, 3-nitrogen cyclic compounds, and amino acids, including a hydrophobic group, which effectively etches copper wires while maintaining stability and straightness, and is formulated to optimize the etching process by controlling the etching rate and preventing decomposition of key components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etchant compositions are used for copper wires, then etching can be performed, but the etching rate is unstable and straightness deteriorates
Solution Approach 1:
The patent modifies the chemical composition parameters of the etchant by incorporating specific concentrations of persulfate (5-20 wt%), sulfonic acid (0.01-15 wt%), fluorine compounds (0.01-2 wt%), and nitrogen cyclic compounds (0.01-5 wt%). This parameter optimization resolves the contradiction by achieving both stable etching profiles with good straightness and reliable etching rates.
Solution Approach 2:
The patent uses a composite etchant formulation combining multiple chemical agents (persulfate, sulfonic acid, fluorine compounds, and nitrogen cyclic compounds) rather than a single etching agent. This composite approach enables simultaneous achievement of stable etching profiles, good wire straightness, and consistent etching rates.
2Productivity
If etching conditions are optimized for high etching rate, then productivity improves, but storage stability deteriorates
Solution Approach 1:
The patent optimizes the concentration parameters of reactive components, particularly maintaining persulfate at 5-20 wt% and sulfonic acid at 0.01-15 wt%, which enables the etchant to deliver high etching rates during use while remaining stable during storage. The balanced formulation prevents premature decomposition.
3Ease of manufacture
If etching composition is simplified, then ease of manufacture improves, but manufacturing precision deteriorates
Solution Approach 1:
The patent employs multifunctional chemical compounds that perform multiple roles: persulfate provides primary etching action, sulfonic acid enhances etching uniformity, fluorine compounds improve wire straightness, and nitrogen cyclic compounds stabilize the etching process. This multi-functionality achieves high etching profile quality without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The etchant composition ensures improved reliability and stability of copper wires by maintaining excellent etching profiles, straightness, and processing capacity, reducing defects and enhancing the overall performance of display devices.
Implementation Method 1
an etchant composition may include about 5.0 to about 20.0 wt % of a persulfate
Implementation Method 2
about 0.01 to about 15.0 wt% of a sulfonic acid
Implementation Method 3
about 0.01 to about 2.0 wt % of a fluorine compound
Data Source
AI summary
Embodiments provide an etchant composition that includes about 5.0 to about 20.0 wt % of a persulfate, about 0.01 to about 15.0 wt % of a sulfonic acid, about 0.01 to about 2.0 wt % of a fluorine compound, about 0.01 to about 5.0 wt % of a 4-nitrogen cyclic compound, about 0.01 to about 1.0 wt % of an amino acid including a hydrophobic group having at least two carbon atoms, and water A weight ratio of the amino acid to the 4-nitrogen cyclic compound is in a range of about 1:16 to about 1:60.