Etching Liquid Composition for Copper-Titanium Laminates
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Solution Overview
Problem
Existing etching liquids fail to maintain desired cross-sectional shapes of fine lines when used continuously for laminates with titanium-based and copper-based layers, leading to increased copper concentration and excessive tapering during etching.
Innovation Solution
An etching liquid composition containing hydrogen peroxide, a fluoride ion source, organic sulfonic acid, azole-based compounds, and water, within specific concentration ranges, is used to etch titanium-based and copper-based layers in a single step, maintaining etching performance and reducing tapering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional etching liquids are used continuously to etch titanium-based and copper-based layers, then the etching process can be performed, but the copper concentration in the etching liquid increases leading to tapering and breakage of fine lines
Solution Approach 1:
The patent modifies the chemical composition parameters of the etching liquid by introducing a specific organic compound with a nitrogen-containing six-membered heterocyclic structure and three double bonds, along with controlling the concentration ranges of hydrogen peroxide (0.1-15 mass%), fluoride ion source (0.01-1 mass%), and organic sulfonic acid (0.1-20 mass%). This parameter optimization prevents copper concentration buildup from causing tapering and breakage while enabling continuous etching operation.
Solution Approach 2:
The patent employs an organic compound with a nitrogen-containing six-membered heterocyclic structure as an intermediary substance that mediates between the copper-based layer and the etching liquid. This intermediary compound selectively interacts with copper ions, preventing their accumulation in the etching liquid and thereby maintaining the desired cross-sectional shape of fine lines during continuous etching processes.
2Productivity
If the etching liquid is reused continuously, then productivity is improved, but the etching performance degrades due to increased copper concentration
Solution Approach 1:
The patent formulates an etching liquid composition that is self-regulating during continuous use. The specific organic compound with the nitrogen-containing heterocyclic structure automatically binds with copper ions released during etching, preventing copper concentration buildup. This self-service mechanism maintains consistent etching performance across multiple reuse cycles without requiring frequent replacement or replenishment.
3Ease of manufacture
If conventional etching liquids are used, then the etching process can be completed, but fine line breakage occurs due to undesired tapering
Solution Approach 1:
The patent optimizes the chemical parameters of the etching liquid by specifying precise concentration ranges for hydrogen peroxide (0.1-15 mass%), fluoride ion source (0.01-1 mass%), and the novel organic compound (0.01-5 mass%). These parameter changes create an etching environment that maintains fine line integrity, preventing breakage while keeping the process simple and effective.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The etching liquid composition allows for the formation of fine lines with desired cross-sectional shapes even when copper concentration increases, maintaining excellent etching performance and reducing the need for frequent liquid replacement.
Implementation Method 1
an etching liquid composition which contains (A) 0.1 to 15 mass % of hydrogen peroxide
Implementation Method 2
0.01 to 1 mass % of a fluoride ion source
Data Source
AI summary
An etching method that includes using the etching liquid composition containing (A) 0.1 to 15 mass % of hydrogen peroxide, (B) 0.01 to 1 mass % of a fluoride ion source, (C) 2-hydroxyethane sulfonic acid or a salt thereof in an amount of 0.1 to 20 mass % in terms of organic sulfonic acid, (D) 0.01 to 5 mass % of at least one compound selected from the group consisting of azole-based compounds and compounds having a structure that has a 6-membered heterocycle including at least one nitrogen atom and three double bonds, and (E) water, is provided.