Etching Stopping Layer for Common Line Cutting in Electro-Optical Devices
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Solution Overview
Problem
The manufacturing of active matrix driving mode liquid crystal devices faces issues with excess current due to electrostatic charges, leading to potential damage of scanning lines and display inconsistencies caused by excessive etching, which can result in reduced manufacturing yield.
Innovation Solution
A method involving the formation of an etching stopping layer below the common line for short-circuiting scanning lines, which prevents etching from affecting lower light-shielding films and allows for reliable cutting of the common line without damaging the substrate, thereby preventing display inconsistencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If excessive etching is performed to remove conductive film and resist from the cutting hole, then the short-circuit wiring line can be reliably cut, but the base insulating film may be thinned or etched, causing cracks in the lower light-shielding film and light leakage
Solution Approach 1:
The patent applies preliminary action by forming the etching stopping layer before forming the cutting hole. This layer is prepared in advance to prevent excessive etching from damaging the base insulating film and light-shielding film, thereby resolving the contradiction between reliably cutting the short-circuit wiring line and maintaining the integrity of underlying films.
Solution Approach 2:
The etching stopping layer acts as an intermediary between the cutting hole etching process and the base insulating film. It mediates the etching process by providing a protective barrier that stops etching before it reaches the base insulating film, thus preventing damage to both the short-circuit wiring line and the underlying films.
2Measurement precision
If the aspect ratio of the cutting hole is made large to improve exposure accuracy, then the photolithography precision is increased, but the resist may remain in the cutting hole and the short-circuit wiring line may not be cut
Solution Approach 1:
The etching stopping layer is formed in advance to enable controlled etching. This preliminary structure allows the use of larger aspect ratios for improved exposure accuracy while ensuring that etching can be properly controlled and monitored to achieve complete cutting of the short-circuit wiring line without leaving resist behind.
Solution Approach 2:
The etching stopping layer provides a visual and physical feedback mechanism during the etching process. Its presence and condition can be monitored to determine when etching has progressed sufficiently to cut the short-circuit wiring line completely, allowing for precise control of the etching depth and ensuring reliable cutting while maintaining exposure accuracy.
3Ease of manufacture
If the common line is cut through excessive etching, then the short-circuit portion is removed, but cracks occur in the lower light-shielding film in the periphery of the cutting hole
Solution Approach 1:
The etching stopping layer is formed in advance to prevent cracks in the lower light-shielding film during the cutting process. This preliminary protective structure allows for simple and direct etching of the common line without causing damage to the light-shielding film, thereby resolving the contradiction between ease of manufacture and manufacturing precision.
Solution Approach 2:
The etching stopping layer serves as an intermediary protective barrier between the etching process and the lower light-shielding film. It absorbs and distributes the mechanical stress and thermal effects of etching, preventing crack formation in the light-shielding film while allowing the common line to be effectively cut.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach stabilizes the manufacturing process, ensuring high-quality displays by preventing damage to scanning lines and maintaining the integrity of light-shielding films, thus enhancing the manufacturing yield of electro-optical devices.
Implementation Method 1
forming a cutting hole in the first interlayer insulating film by etching so as to cut the common line
Data Source
AI summary
A method of manufacturing an electro-optical device, which, on a substrate, has a plurality of data lines, a plurality of scanning lines, a plurality of driving elements formed to correspond to intersections of the plurality of data lines and the plurality of scanning lines for pixels, and a plurality of pixel electrodes provided to correspond to the driving elements, includes forming an etching stopping layer, forming a common line that is provided above the etching stopping layer to short-circuit the plurality of scanning lines and the plurality of scanning lines, forming a first interlayer insulating film that isolates the plurality of data lines and the plurality of pixel electrodes from the plurality of scanning lines and the plurality of driving elements, forming contact holes that electrically connect the plurality of data lines and the plurality of pixel electrodes to the plurality of driving elements, forming the plurality of data lines, and forming a cutting hole in the first interlayer insulating film by etching so as to cut the common line.