Eutectic Bonded LED Package with Wavelength Conversion
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Solution Overview
Problem
Conventional light emitting device packages face challenges in reducing manufacturing costs and miniaturization, particularly in display devices that do not use backlight units, which limits their compact size and optical efficiency.
Innovation Solution
A light emitting device package is designed with a cell array of three light emitting devices, each with a conductivity-type semiconductor layer and an active layer, bonded to a light-transmissive substrate with wavelength conversion portions and a eutectic bonding layer, allowing for efficient light emission and miniaturization without the need for a partition structure, thereby simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional light emitting device packages use traditional partition structures, then structural support and separation are provided, but device size cannot be minimized and manufacturing cost increases
Solution Approach 1:
The patent removes the traditional partition structure from the light emitting device package. The cell array is directly bonded to the light-transmissive substrate without intermediate partition structures, extracting the unnecessary structural element while maintaining functional separation through the bonding layer configuration.
Solution Approach 2:
The patent merges the cell array directly with the light-transmissive substrate through the eutectic bonding layer, eliminating intermediate structures. The bonding layer serves multiple functions simultaneously: structural support, electrical connection, and optical transmission, combining several functions into a single integrated interface.
2Ease of manufacture
If conventional packages include multiple structural layers for support, then mechanical strength is maintained, but manufacturing cost increases
Solution Approach 1:
The eutectic bonding layer performs multiple functions simultaneously: it provides mechanical bonding between the cell array and substrate, enables electrical connections, allows optical transmission for wavelength conversion, and provides structural support. This multi-functionality reduces the need for separate structural layers, simplifying manufacturing and reducing costs.
Solution Approach 2:
The patent employs eutectic bonding, which utilizes specific temperature-composition parameters to achieve low-temperature bonding. This parameter change allows bonding at lower temperatures compared to conventional methods, reducing manufacturing complexity and cost while maintaining structural integrity.
3Manufacturing precision
If light emitting devices are arranged in compact arrays, then display resolution improves, but optical efficiency may be compromised
Solution Approach 1:
The light-transmissive substrate acts as an intermediary between the compact cell array and the external environment. It provides optical pathways for wavelength-converted light to exit efficiently while maintaining the compact arrangement of the cell array, thus preserving both high resolution and optical efficiency.
Solution Approach 2:
The patent implements local wavelength conversion regions on the light-transmissive substrate, where different areas convert different wavelengths of light. This local quality approach allows efficient light extraction and color separation in compact configurations, maintaining optical efficiency while achieving high display resolution through precise spatial control of optical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces manufacturing costs and enables miniaturization of light emitting device packages, improving optical efficiency and allowing for high-resolution displays without the limitations of traditional partition structures, while maintaining independent driving of subpixels.
Implementation Method 1
a eutectic bonding layer including a first light emitting window, a second light emitting window and a third light emitting window corresponding to the first light emitting device, the second light emitting device and the third light emitting device, respectively, the eutectic bonding layer bonding the light-transmissive substrate and the first to third light emitting devices to each other
Implementation Method 2
a light-transmissive substrate including a first wavelength conversion portion and a second wavelength conversion portion corresponding to the first light emitting device and the second light emitting device, respectively
Data Source
AI summary
A light emitting device package including a cell array including first, second and third light emitting devices each including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, the cell array having a first surface and a second surface opposing the first surface, a light-transmissive substrate including a first wavelength conversion portion and a second wavelength conversion portion corresponding to the first light emitting device and the second light emitting device, respectively, and bonded to the first surface, and a eutectic bonding layer including a first light emitting window, a second light emitting window and a third light emitting window corresponding to the first light emitting device, the second light emitting device and the third light emitting device, respectively, and bonding the light-transmissive substrate and the first to third light emitting devices to each other may be provided.