EUV Metallic Resist Additives for Shelf Life and CD Control
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Solution Overview
Problem
Conventional metallic resists used in EUV lithography face issues with aging and poor critical dimension (CD) control, which are not adequately addressed by existing technologies.
Innovation Solution
The addition of specific additives such as high boiling point solvents, photo acid generators, photo base generators, quenchers, photo decomposed bases, thermal acid generators, and photo sensitivity cross-linkers to metallic photoresists to improve shelf life and CD control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional metallic resist is used for EUV lithography, then the lithography process can be performed, but the shelf life is short and CD control is poor
Solution Approach 1:
The patent changes the chemical composition parameters of the metallic resist by introducing specific additives (photo acid generator, photo base generator, quencher, thermal acid generator) to modify the resist's stability and performance characteristics, thereby extending shelf life and improving CD control
Solution Approach 2:
The patent creates a composite resist system by combining conventional metallic resist materials with specific functional additives, resulting in a multi-component material that exhibits improved shelf life and critical dimension control properties
2Reliability
If conventional metallic resist is used for EUV lithography, then the lithography process can be performed, but aging problems occur
Solution Approach 1:
The patent incorporates photo acid generators and thermal acid generators that perform preliminary chemical actions to stabilize the metallic resist structure before aging occurs, preventing degradation and extending the operational duration
Solution Approach 2:
The patent introduces quenchers and photo base generators as intermediary substances that mediate between the metallic resist and environmental factors, preventing direct degradation and extending shelf life
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The additives significantly enhance the shelf life of metallic photoresists by over a month and tighten CD control to within 10% variation, addressing the aging and CD control issues in EUV lithography.
Implementation Method 1
The additive includes a photo acid generator
Implementation Method 2
The additive includes a thermal acid generator
Implementation Method 3
The additive includes a solvent having a boiling point greater than about 150 degrees Celsius
Data Source
AI summary
A photoresist layer is formed over a wafer. The photoresist layer includes a metallic photoresist material and one or more additives. An extreme ultraviolet (EUV) lithography process is performed using the photoresist layer. The one or more additives include: a solvent having a boiling point greater than about 150 degrees Celsius, a photo acid generator, a photo base generator, a quencher, a photo de-composed base, a thermal acid generator, or a photo sensitivity cross-linker.