Photosensitive Material Processing TRIZ Cases
- Resist Underlayer Composition for Fine Pattern Adhesion and Uniformity
A polymer resist underlayer improves thin photoresist adhesion, film uniformity, and exposure sensitivity for fine semiconductor patterning.
- Cellulose Nanocrystal Powder Grafting Without Vinyl Acetate Hydrolysis
A carboxylate-stabilized cerium initiator enables acid-free vinyl acetate grafting on cellulose nanocrystals with high yield and uniform dispersion.
- Low-Temperature Photoresist Composition for Flexible Optical Films
A catalyst-free photoresist combines unsaturated monomers and epoxy compounds to form optical films below 150°C with strong chemical resistance.
- Chemically Amplified Positive Resist for Acid Diffusion Control
A low-dispersity polymer resist limits acid diffusion to improve small-feature resolution, line-edge roughness, profile rectangularity, and etch resistance.
- Negative-Type Photosensitive Resin for Low-Temperature Imidization
A thermal base generator enables imide ring-closing at 200°C or lower while maintaining storage stability, fine patterning, and chemical resistance.
- Magnetic Heating Plate Fixing for Thermal Expansion Flatness
Magnetic fixing members hold a substrate heating plate in position while allowing thermal expansion, preventing tilt, sealing failure, and particle contamination.
- Organoindium EUV Photoresist Patterning for Thin-Layer Etch Resistance
An organoindium EUV resist uses pretreatment and gas development to keep ultrathin patterns sensitive, precise, and etch resistant.