Negative-Type Photosensitive Resin for Low-Temperature Imidization
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Solution Overview
Problem
Existing photosensitive resin compositions using polyimide precursors face challenges in achieving imide ring-closing reactions at low temperatures, suffer from poor chemical resistance and corrosion, and have storage stability issues, which are critical for high-density mounting technologies in semiconductor devices.
Innovation Solution
A negative-type photosensitive resin composition incorporating a polymer compound with a polyimide precursor structure, a photopolymerization initiator, and an organic compound represented by specific general formulae, allowing imide ring-closing reactions at 200°C or lower, enhancing storage stability and chemical resistance, and enabling fine patterning without pattern deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If imidization treatment is performed at high temperature (higher than 300°C) to obtain target polyimide coating, then the polyimide film achieves desired insulation and mechanical strength, but the base substrate is limited, copper wiring oxidizes, and thermal damage risk increases
Solution Approach 1:
The patent changes the temperature parameter from conventional high temperature (300°C or higher) to low temperature (200°C or lower) by introducing a thermal base generator that produces a base through pyrolysis, enabling the imide ring-closing reaction to proceed at reduced temperatures and preventing thermal damage to substrates and wiring
Solution Approach 2:
The patent introduces a thermal base generator as an intermediary substance that decomposes to generate a base, which then catalyzes the imide ring-closing reaction. This intermediary enables the reaction to occur at low temperatures without requiring direct high-temperature treatment
2Temperature
If natural compounds causing pyrolysis are used as thermal base generators to enable low-temperature imidization (200°C or lower), then the imide ring-closing reaction is enhanced, but the cured film exhibits poor corrosion resistance and chemical resistance
Solution Approach 1:
The patent creates a composite system combining a polyimide precursor, a thermal base generator, and a photopolymerization initiator. This composite approach allows the thermal base generator to enable low-temperature imidization while the photopolymerization component ensures proper curing and maintains corrosion and chemical resistance of the final film
3Stability of the object's composition
If polyimide precursor composition is stored, then the cyclization reaction of the polyimide precursor resin proceeds during storage causing gelation, but the composition loses storage stability
Solution Approach 1:
The patent prepares the polyimide precursor composition in advance with all necessary components (polyimide precursor, thermal base generator, photopolymerization initiator, solvent) but prevents premature reaction. The photopolymerization initiator remains dormant during storage and activates only upon light exposure, allowing stable storage while maintaining reaction capability
4Speed
If imidazoles are added as imidization catalyst to enhance imide ring-closing reaction, then the reaction is accelerated, but pattern deformation due to heat occurs and glass transition temperature decreases
Solution Approach 1:
The patent uses a thermal base generator that produces a base through controlled pyrolysis as an intermediary to catalyze the imide ring-closing reaction. This approach accelerates the reaction without requiring high temperatures, thereby preventing pattern deformation and maintaining glass transition temperature
5Manufacturing precision
If high-temperature curing is used to achieve fine patterning with high aspect ratio, then the pattern precision is improved, but thermal flow causes pattern deformation
Solution Approach 1:
The patent changes the curing temperature parameter from high temperature to low temperature (200°C or lower) by using a thermal base generator. This temperature reduction eliminates thermal flow that causes pattern deformation while still achieving complete imide ring-closing reaction and maintaining fine patterning with high aspect ratio
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables low-temperature curing with improved storage stability, chemical resistance, and high glass transition temperature, facilitating fine patterning and reliable interlayer insulating films and surface protecting films for electronic components.
Implementation Method 1
a photopolymerization initiator; (C) a polymerizable compound having two or more ethylenically unsaturated groups
Implementation Method 2
a thermal base generator to generate a base with heat; wherein the polyimide precursor is a polyamic acid, and the thermal base generator is a natural compound that causes pyrolysis by heating at a temperature of 200°C or lower to generate a secondary amine
Implementation Method 3
an organic compound represented by the following general formula (1); wherein T represents any one structure of the following general formulae (2) to (4)
Data Source
AI summary
A negative-type photosensitive resin composition, including: (A) a polymer compound including a polyimide precursor structure; (C) a photopolymerization initiator; (D) an organic compound represented by the following general formula (1); and (E) a solvent. This can provide: a photosensitive resin composition that allows an imide ring-closing reaction at low temperature, that has excellent stability of the composition, that uses a polyimide precursor that enables fine patterning, and that can impart resistance against chemicals after curing. In addition, an object of the present invention is to provide: a patterning process using the above photosensitive resin composition; an interlayer insulating film including a cured coating formed by curing the photosensitive resin composition; and a semiconductor device.