Evaporation Source External Cooling Chamber Design
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Solution Overview
Problem
Cylindrical evaporation sources in vacuum arc evaporation methods face challenges with inefficient cooling, which occupies valuable space and leads to heat dissipation issues, increasing costs and maintenance complexity.
Innovation Solution
An evaporation source design with a cooling chamber adjacent to the outer support body allows direct heat absorption and removal of cooling fluid, keeping the interior space free for other components and avoiding contact with cooling fluid to prevent corrosion, thus enhancing cooling efficiency and reducing thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling system is placed inside the evaporation source, then cooling effect is achieved, but internal space is occupied and components are exposed to cooling fluid causing corrosion
Solution Approach 1:
The cooling system is extracted from the internal space of the evaporation source and placed in the external region. The cooling chamber is positioned outside the cylindrical target carrier, allowing the cooling fluid to flow around the external surface of the target carrier, thus achieving cooling without occupying valuable internal space where magnet systems and other components are located.
Solution Approach 2:
The external cooling chamber acts as an intermediary cooling structure that transfers heat from the evaporation source through the wall of the target carrier. The cooling fluid flows in the external chamber, absorbing heat through the target carrier wall, thus cooling the internal components without direct contact between cooling fluid and internal components, preventing corrosion.
2Temperature
If cooling fluid contacts internal components, then cooling is provided, but corrosion occurs and maintenance complexity increases
Solution Approach 1:
The cooling fluid and cooling chamber are extracted from the internal environment and placed externally. This separation ensures that corrosive cooling fluids never come into contact with internal components such as magnet systems, electrical lines, and electronic devices, thereby eliminating corrosion risks and reducing maintenance requirements.
Solution Approach 2:
The target carrier wall serves as an intermediary barrier between the cooling fluid and internal components. Heat is transferred through this barrier from the internal components to the external cooling fluid, achieving effective cooling while preventing direct contact between the cooling fluid and sensitive internal components, thus protecting them from corrosion.
3Temperature
If internal space is used for cooling, then cooling is achieved, but space for magnet systems and other components is reduced
Solution Approach 1:
The cooling function is extracted from the internal space and relocated to an external cooling chamber. This allows the internal cylindrical space of the target carrier to remain completely available for housing magnet systems, electrical lines, electronic devices, and other necessary components, while the external cooling chamber provides adequate space for cooling fluid circulation.
Solution Approach 2:
The cooling system is moved from the internal three-dimensional space to an external annular region surrounding the target carrier. This dimensional relocation allows both the internal space and external cooling space to be fully utilized without competition for the same physical volume, maximizing both component accommodation and cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design provides efficient cooling without occupying internal space, protecting components from excessive heat, reducing maintenance, and extending their service life while maintaining the quality of coatings by preventing heat-related quality deterioration.
Implementation Method 1
allows direct heat absorption and removal of cooling fluid
Implementation Method 2
cooling fluid circulating in the cooling chamber
Implementation Method 3
the surface of a target is converted into the vapor form in an electric arc
Implementation Method 4
atoms are converted into the vapor form from a surface of a target by means of ionized particles
Implementation Method 5
uses magnetic fields to direct the electrons away from the substrate surface
Data Source
Figure 1a
Figure 1b
Figure 2
AI summary
Evaporation source (1) comprises an inner base body (3) which is arranged in an outer carrier body (2) and which is arranged with respect to the outer carrier body such that a cooling space is formed in flow communication with an inlet (4) and an outlet (5) between the base body and the carrier body. The cooling space comprises an inflow space and an outflow space and is in flow communication with the outflow space via an overflow connection for cooling the evaporation source such that a cooling fluid can be conveyed from the inlet via the inflow space to the outlet. Evaporation source (1) comprises an inner base body (3) which is arranged in an outer carrier body (2) and which is arranged with respect to the outer carrier body such that a cooling space is formed in flow communication with an inlet (4) and an outlet (5) between the base body and the carrier body. The cooling space comprises an inflow space and an outflow space and is in flow communication with the outflow space via an overflow connection for cooling the evaporation source such that a cooling fluid can be conveyed from the inlet via the inflow space, from the overflow connection and the outflow apace to the outlet.