Exhaust Pipe Design for Thermal Processing Apparatus
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Solution Overview
Problem
Existing thermal processing apparatuses for semiconductor wafers and LCD glass substrates face frequent clogging and maintenance issues due to the generation of impurities like sublimes during heat processing, which contaminates the substrate and clogs exhaust pipes, making maintenance cumbersome.
Innovation Solution
A thermal processing apparatus with a lid body featuring multiple exhaust ports and an exhaust pipe system that evenly disperses gases and impurities, preventing contamination and easy detachment for cleaning, along with a coating film or inner tube to reduce impurity adherence, and a dual-outlet system with clogging detection for extended maintenance intervals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a plurality of current plates for exhaust are provided on the peripheral side portion of the lid body to evenly disperse the exhaust, then the exhaust is dispersed evenly, but cleaning and maintenance work becomes troublesome because multiple current plates are provided
Solution Approach 1:
The patent merges the exhaust dispersion function and the exhaust flow function into a single integrated exhaust pipe structure. The exhaust pipe includes a main body with multiple exhaust holes formed directly on its surface, eliminating the need for separate current plates. This integration maintains even exhaust dispersion while significantly simplifying maintenance, as the exhaust pipe can be easily detached and cleaned as a single component.
2Object-generated harmful factors
If an impurity collecting portion is provided along the exhaust line to collect sublimate and impurities, then impurities are collected, but the exhaust pipe is clogged in a short time requiring frequent maintenance
Solution Approach 1:
The patent extracts the impurity collection function from within the exhaust pipe system and relocates it to a separate, easily removable impurity collecting portion positioned at the downstream end of the exhaust line. This allows impurities to be collected effectively while enabling quick removal and cleaning of the collecting portion without disassembling the entire exhaust pipe system, thereby reducing maintenance frequency and time.
3Productivity
If the exhaust pipe outlet is positioned to exhaust gas efficiently, then gas flow is efficient, but impurities adhere to the outlet pipe causing clogging
Solution Approach 1:
The patent introduces an intermediary impurity collecting portion that intercepts impurities before they reach the exhaust pipe outlet. This collecting portion acts as a mediator that captures sublimate and other impurities in the exhaust flow, preventing them from adhering to the outlet pipe. The collection portion can be easily removed and cleaned, maintaining high exhaust efficiency while preventing clogging and ensuring reliable operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents substrate contamination, reduces impurity adherence in the exhaust pipe, facilitates easy maintenance, and extends the maintenance cycle by ensuring efficient gas flow and impurity removal, thereby improving yield and apparatus reliability.
Implementation Method 1
a heating unit for heating the substrate on the thermal processing plate to a predetermined temperature
Implementation Method 2
a cooling unit for cooling the substrate on the thermal processing plate to a predetermined temperature after the heating by the heating unit
Implementation Method 3
The upper surface portion of the lid body is provided with a supply port for supplying a gas into the processing chamber
Implementation Method 4
a side portion of the upper surface portion of the lid body is provided with a plurality of exhaust ports for exhausting the gas in the processing chamber
Data Source
AI summary
A thermal processing apparatus for thermally processing a substrate in a processing chamber includes a heating plate for mounting and thermally processing the substrate thereon, and a lid body covering the heating plate from above to constitute a portion of the processing chamber. The lid body has a ceiling plate and a peripheral side portion vertically provided at a peripheral end portion of the ceiling plate. The ceiling plate is provided with a supply port for supplying a gas into the processing chamber, and a side portion of the ceiling plate is provided with a plurality of exhaust ports for exhausting the gas in the processing chamber. An exhaust pipe communicating with the exhaust ports and having an outlet at a point at equal distances from the exhaust ports is provided to be attachable and detachable to/from the lid body. According to the present invention, the maintenance work against clogging due to the impurities such as a sublimate and the like generated by the thermal processing can be easily performed.