Expanded Heat Spreader Package for Clip-Constrained Cooling
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Solution Overview
Problem
The inclusion of metal interconnect clips in dual side cooling semiconductor packages creates geometric constraints that limit the placement of cooling features, restricting the effective thermal dissipation capacity.
Innovation Solution
A semiconductor package design featuring an interconnect clip with a large planar section that laterally extends past the die pad, accommodating a heat spreader that expands in multiple directions, providing a larger cooling surface area while maintaining electrical connectivity, and incorporating a multi-thickness configuration to further enhance thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal interconnect clips are included in dual side cooling semiconductor packages, then electrical connectivity is achieved, but geometric constraints limit the placement of cooling features
Solution Approach 1:
The interconnect clip is segmented into multiple functional sections: a body portion for electrical connection, and an expanded planar section that serves as a mounting platform for cooling features. This segmentation allows the clip to simultaneously fulfill electrical and thermal functions without geometric conflict.
Solution Approach 2:
The interconnect clip extends from a vertical connection structure into a horizontal planar section, utilizing the lateral dimension to create mounting space for cooling features. This dimensional transition resolves the conflict between vertical electrical connectivity and horizontal cooling feature placement.
2Temperature
If cooling surface area is increased to improve thermal dissipation, then thermal dissipation capacity is enhanced, but package geometry becomes more complex
Solution Approach 1:
The interconnect clip and heat spreader are merged into a single integrated structure. The clip's planar section serves dual purposes as both an electrical interconnect and a thermal spreading element, eliminating the need for separate components and simplifying the overall package geometry.
Solution Approach 2:
The expanded planar section of the interconnect clip performs multiple functions: providing electrical connectivity, serving as a thermal spreading path, and offering mounting surfaces for additional cooling features. This multi-functionality increases cooling surface area without proportionally increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for at least twice the cooling surface area of the semiconductor die, significantly improving thermal dissipation capabilities and accommodating bond wire connections, thus enhancing the package's cooling efficiency.
Implementation Method 1
a heat spreader mounted on top of the interconnect clip. The heat spreader covers an area of the first planar section that is larger than an area of the semiconductor die
Data Source
Figure 1A~1B
Figure 1C~1E
Figure 2A~2C
AI summary
A semiconductor package includes a die pad having a die attach surface, a first laterally separated and vertically offset from the die pad, a semiconductor die mounted on the die attach surface and comprising a first terminal on an upper surface of the semiconductor die, an interconnect clip that is electrically connected to the first terminal and to the first lead, and a heat spreader mounted on top of the interconnect clip. The interconnect clip includes a first planar section that interfaces with the upper surface of the semiconductor die and extends past an outer edge side of the die pad. The heat spreader covers an area of the first planar section that is larger than an area of the semiconductor die. The heat spreader laterally extends past a first outer edge side of the die pad that faces the first lead.