Expanded Waveguide With Multilateral Pillars For Uniform E-Plane Field
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Solution Overview
Problem
Current expanded waveguides face challenges in providing uniform electromagnetic field distribution, especially in frequency bands above W-band, due to metal packaging issues and complex manufacturing processes, which hinder efficient semiconductor array installation and high-power electromagnetic component development.
Innovation Solution
An expanded waveguide design that expands in the E-plane direction, featuring a transition area with multilateral pillars forming a binary tree channel structure, ensuring uniform electromagnetic wave distribution by maintaining equal path lengths and using specific pillar shapes and structures to minimize reflections and mode generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the waveguide size is increased to accommodate semiconductor arrays in high frequency bands, then the semiconductor array can be installed, but multiple modes are generated causing non-uniform electromagnetic field distribution
Solution Approach 1:
The waveguide is segmented into a standard waveguide portion and an expanded waveguide portion. The expanded portion further divides the electromagnetic wave path into multiple channels using multilateral pillars, allowing each channel to maintain uniform field distribution while the overall structure provides increased volume for semiconductor array installation.
Solution Approach 2:
Different portions of the waveguide have different structural characteristics. The standard waveguide portion maintains conventional dimensions, while the expanded waveguide portion increases in cross-sectional area. Within the expanded portion, multilateral pillars create localized channels with specific geometric properties that ensure uniform electromagnetic field distribution in each local region.
2Temperature
If metal packaging is used to block external emission, then semiconductor chip overheating is prevented, but power distribution in the semiconductor array becomes non-uniform
Solution Approach 1:
The metal packaging structure is segmented by introducing multilateral pillars that create multiple separate channels. This segmentation allows electromagnetic waves to be distributed uniformly across different paths while the outer metal packaging continues to provide thermal management by blocking external emission and containing heat within the structured channels.
Solution Approach 2:
The multilateral pillars act as intermediary structures between the metal packaging walls and the electromagnetic wave propagation paths. These pillars divide the enclosed metal space into uniform channels, ensuring that the thermal benefits of metal packaging are maintained while the electromagnetic field distribution is corrected to be uniform across all channels.
3Ease of manufacture
If H-plane cut is used for manufacturing expanded waveguide blocks, then the waveguide can be manufactured, but the process becomes complicated and loss occurs
Solution Approach 1:
The multilateral pillars have asymmetric cross-sectional shapes (such as L-shaped, T-shaped, or other non-circular geometries) that are optimized for E-plane expansion. This asymmetric design allows the waveguide to be manufactured using standard E-plane cutting processes without requiring complex H-plane cuts, simplifying the manufacturing process while maintaining the expanded volume capability.
4Adaptability or versatility
If individual semiconductor chips are installed to form arrays, then the arrays can be configured, but the installation process becomes inconvenient and complex
Solution Approach 1:
The expanded waveguide structure is segmented into multiple standardized channels by the multilateral pillars. Each channel can independently accommodate semiconductor chips or pre-assembled modules, allowing flexible configuration of semiconductor arrays while simplifying installation through modular placement rather than individual chip mounting. The uniform channel dimensions provide standardized interfaces for easy insertion and alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design secures space for one-dimensional semiconductor arrays, providing uniform electromagnetic fields across high-frequency bands, enabling efficient spatial power combining and high-output electromagnetic wave generation for applications like long-distance radar and communication devices.
Implementation Method 1
an input transition area and an output transition area connected to both sides of the expanded area and configured to pass an electromagnetic wave
Data Source
AI summary
An expanded waveguide for providing uniform electromagnetic field is disclosed. The expanded waveguide comprises an expanded area expanded in the direction of the E-plane, an input transition area and an output transition area connected to both sides of the expanded area and configured to pass an electromagnetic wave, and entrance parts formed respectively to an end part of the input transition area and an end part of the output transition area, the electromagnetic wave being inputted and outputted through the entrance parts. Here, a plurality of multilateral pillars are arranged in constant space in the transition areas, and a channel is formed along between the multilateral pillars.