Expansion Sheet Peripheral Adhesion Control via UV Light
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Solution Overview
Problem
Expansion sheets used in the processing of platelike workpieces, such as semiconductor wafers, often face difficulties in being easily removed from holding units due to strong adhesive properties, which can lead to damage and handling issues during chip separation.
Innovation Solution
The expansion sheet features a peripheral area with reduced adhesion, achieved by applying ultraviolet light to the adhesive layer, allowing for easier detachment from holding units during the expansion and processing of workpieces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhesive layer has strong adhesion to hold the expansion sheet on the holding unit, then the holding reliability is improved, but the expansion sheet cannot be easily removed from the holding unit
Solution Approach 1:
The adhesive layer is designed with spatially varying adhesion properties: the central region maintains high adhesion to securely hold the expansion sheet during processing, while the peripheral region has reduced adhesion to enable easy removal from the holding unit. This local differentiation resolves the contradiction between holding reliability and removal ease.
Solution Approach 2:
The adhesive layer is segmented into functionally distinct regions: a central high-adhesion zone and a peripheral low-adhesion zone. This segmentation allows each region to perform its specific function independently, enabling the expansion sheet to be firmly held during operation while facilitating easy detachment afterward.
2Ease of operation
If ultraviolet light is applied to reduce adhesion in the peripheral area, then the removal ease is improved, but the manufacturing process complexity increases
Solution Approach 1:
The mechanical process of creating adhesion differences is replaced by applying ultraviolet light to selectively reduce adhesion in the peripheral region. This optical approach simplifies the manufacturing process compared to mechanical methods while achieving the desired differential adhesion properties.
Solution Approach 2:
The adhesion parameter of the adhesive layer is changed by applying ultraviolet light, which modifies the chemical or physical properties of the adhesive material in the peripheral region. This parameter change enables easy removal without requiring complex mechanical modifications to the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reduced adhesion in the peripheral area enables straightforward removal of the expansion sheet from holding units, preventing damage and facilitating efficient chip handling and processing.
Implementation Method 1
an adhesive layer formed on the base sheet, the adhesive layer having adhesion adapted to be reduced by applying ultraviolet light
Data Source
AI summary
An expansion sheet is adapted to be held and expanded by an expanding apparatus when a platelike workpiece is attached to the expansion sheet. The expansion sheet has a peripheral area around the workpiece where the expansion sheet is adapted to be held by first, second, third, and fourth holding units that are moveable away from each other. The expansion sheet includes a base sheet and an adhesive layer formed on the base sheet, the adhesive layer having adhesion adapted to be reduced by applying ultraviolet light. The adhesion of the adhesive layer in the peripheral area of the expansion sheet is lower than that in the other area of the expansion sheet.