Exposed Bond Wire Packaging for Stable Stacked Semiconductor Dies
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Solution Overview
Problem
Semiconductor device packages face issues with wire sweep and limited mechanical support due to vertical bond wires and stacking of numerous dies within a confined space, leading to potential die bending and collapse.
Innovation Solution
The semiconductor device package design includes bond wires with intermediate portions exposed on the surface of a molding compound, providing a larger electrical interface area and mechanical support, and multiple substrates to stabilize stacked dies, reducing the risk of wire sweep and die deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vertical bond wires are used to electrically connect semiconductor device packages, then electrical connectivity between packages is achieved, but the bond wires are prone to wire sweep and provide limited surface area for electrical connection
Solution Approach 1:
The bond wire configuration transitions from a purely vertical orientation to include intermediate portions that extend horizontally along the top surface of the molding compound. This dimensional change creates a larger surface area for electrical connection and reduces susceptibility to wire sweep while maintaining electrical connectivity between stacked semiconductor device packages.
2Quantity of substance
If multiple semiconductor dies are stacked one on top of the other within a limited space, then storage capacity is increased, but die bending and collapse occur due to lack of mechanical support
Solution Approach 1:
The intermediate portions of the bond wires serve as mechanical intermediaries that extend along the top surface of the molding compound. These exposed wire portions provide additional structural support to the stacked dies, preventing die bending and collapse while enabling increased stacking density for higher storage capacity.
3Reliability
If vertical bond wires are used for inter-package connection, then electrical connectivity is established, but the surface area for electrical connection is relatively small
Solution Approach 1:
The bond wire structure extends from a one-dimensional vertical connection to a two-dimensional configuration with intermediate portions running along the top surface. This dimensional expansion significantly increases the surface area available for electrical connection while maintaining the vertical electrical pathway between packages.
Data Source
AI summary
A semiconductor device package includes a first substrate having an electrical circuit, semiconductor dies stacked one on top of the other, and bond wires electrically connected one to another. The bond wires electrically couple the semiconductor dies to one another and to the electrical circuit. There is a first bond wire having a first portion connected to a first semiconductor die, a second portion connected to a second semiconductor die, and an intermediate portion between the first portion and second portion. The semiconductor device package further includes a molding compound encapsulating the semiconductor dies, and the first and second portions of the first bond wire. The intermediate portion of the first bond wire is exposed along a top planar surface of the molding compound. The semiconductor device package may be used for coupling one or more other semiconductor device packages thereto via the exposed intermediate portion.