Extended EMI Shield Beneath Memory Modules for Compact PCBs
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Solution Overview
Problem
Designing effective electromagnetic interference (EMI) shields for memory modules in compact electronic devices is challenging due to space constraints, leading to compromises between EMI shielding efficiency and PCB size, as traditional solutions either interfere with other components or require larger PCBs.
Innovation Solution
The development of extended EMI shields that wrap underneath memory modules, allowing ground contacts and plated through holes to be positioned optimally without interfering with memory routing, thus maintaining EMI shielding efficiency while reducing PCB size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional EMI shields are used with PCB ground contacts and vias, then EMI shielding can be provided, but the ground contacts and vias interfere with other components on the PCB due to space constraints
Solution Approach 1:
The EMI shield extends underneath the memory module by utilizing the vertical dimension and extending into the space below the module. This allows ground contacts to be positioned on the bottom surface of the PCB rather than competing for space on the top surface, effectively adding a spatial dimension for ground contact placement and eliminating interference with other components.
Solution Approach 2:
The EMI shield is divided into multiple sections: a top portion that covers the memory module and a bottom portion that extends underneath the module. This segmentation allows the ground contacts to be strategically positioned on the bottom surface while maintaining EMI shielding effectiveness, separating the grounding function from the component placement area.
2Area of stationary object
If PCB size is reduced to accommodate space constraints, then device size decreases, but EMI shielding efficiency is compromised
Solution Approach 1:
By extending the EMI shield underneath the memory module and positioning ground contacts on the bottom surface of the PCB, the design utilizes the vertical and underspace dimensions. This allows full EMI shielding coverage without requiring additional horizontal PCB area, maintaining shielding effectiveness while enabling smaller PCB size.
3Area of stationary object
If ground contacts are positioned closer to memory routing, then PCB size is reduced, but interference with memory routing occurs
Solution Approach 1:
The ground contacts are positioned on the bottom surface of the PCB, utilizing the vertical dimension and the space underneath the memory module. This spatial repositioning removes the ground contacts from the same plane as the memory routing, eliminating potential interference while allowing for compact PCB design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables smaller PCBs with enhanced EMI shielding, cost savings, and increased battery capacity without sacrificing performance, particularly beneficial for small form factor devices.
Implementation Method 1
EMI shields are typically made of conductive materials (e.g., metals such as aluminum, copper), which absorb or reflect electromagnetic waves, thus preventing them from penetrating or escaping the shielded area.
Data Source
Figure 1
Figure 2A~2E
Figure 3A~3C
AI summary
Devices and systems for shielding electromagnetic interference, and methods of forming the same, are disclosed herein. In one example, an electromagnetic interference (EMI) shield includes a housing to substantially enclose a memory module. When the housing and the memory module are coupled to a circuit board, the housing is to extend at least partially underneath the memory module. The housing may also be openable or at least partially removable.